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MC3346 XF45061 AP2181D T4110 N74F832N OBTS141 CHA5197A 00SERI
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  geometries Datasheet PDF File

For geometries Found Datasheets File :: 534    Search Time::1.516ms    
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    Atmel Corp
Part No. TK5552NBSP TK5552
OCR Text ...y on the base station, the coil geometries and the modulation options chosen (see U2270B Antenna Design Hints and the U2270B data sheet). When using the Atmel Wireless & Microcontrollers U2270B demo board, the typical distances in the range...
Description Plastic-stick transponder with 1-Kbit memory, Manchester RF/16, RF/32
From old datasheet system

File Size 144.92K  /  20 Page

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    Atmel
Part No. TK5552
OCR Text ...y on the base station, the coil geometries and the modulation options chosen (see U2270B Antenna Design Hints and the U2270B data sheet). When using the TEMIC U2270B demo board, the typical distances in the range of 0 to 5 cm can be achieve...
Description Read/Write Transponder

File Size 156.65K  /  20 Page

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    IRF6609 IRF660B9 IRF6618TR1 IRF6618

IRF[International Rectifier]
Part No. IRF6609 IRF660B9 IRF6618TR1 IRF6618
OCR Text ...compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and p...
Description Power MOSFET

File Size 228.02K  /  10 Page

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    IRF6613

IRF[International Rectifier]
Part No. IRF6613
OCR Text ...compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and p...
Description HEXFET Power MOSFET

File Size 230.99K  /  8 Page

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    IRF6635

IRF[International Rectifier]
Part No. IRF6635
OCR Text ...compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and p...
Description DirectFET Power MOSFET

File Size 238.01K  /  9 Page

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    IRF6665

IRF[International Rectifier]
Part No. IRF6665
OCR Text ...compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing method and pr...
Description DIGITAL AUDIO MOSFET

File Size 222.72K  /  8 Page

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    IRF[International Rectifier]
Part No. IRF6614
OCR Text ...compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and p...
Description DirectFET Power MOSFET

File Size 253.86K  /  9 Page

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    Philips
Part No. AN240
OCR Text ...use technologies with such fine geometries that 5V is simply not allowed any more. The introduction of the 3V standard as supply voltage has resulted in many design activities for digital systems. Very often, however, there is a gradual tra...
Description Interfacing 3V and 5V Applications

File Size 55.02K  /  7 Page

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    Zarlink Semiconductor
Part No. CLA70000
OCR Text ...facility for sub-micron process geometries. The factory uses the latest automated equipment for 6 inch wafers and Computer Aided Manufacturing techniques to ensure production efficiency. Wafer fabrication is carried out in Class 10, or bett...
Description High Density CMOS Gate Arrays

File Size 189.15K  /  17 Page

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    IRF[International Rectifier]
Part No. IRF6631
OCR Text ...compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and p...
Description DirectFET Power MOSFET

File Size 238.38K  /  9 Page

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For geometries Found Datasheets File :: 534    Search Time::1.516ms    
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