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2N7002 MIC812SU HT83XXX D74LV WMN6T KT511 T3324551 CG144PP
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  deposition Datasheet PDF File

For deposition Found Datasheets File :: 147    Search Time::1.515ms    
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    240-050-3P01A 240-050-3P01B 240-050-3P01C 240-050-3P01D 240-050-3P01E 240-050-3S01A 240-050-3S01B 240-050-3S01C 240-050-

GLENAIR INC
Glenair, Inc.
Part No. 240-050-3P01A 240-050-3P01B 240-050-3P01C 240-050-3P01D 240-050-3P01E 240-050-3S01A 240-050-3S01B 240-050-3S01C 240-050-3S01D 240-050-3S01E 240-050-3S01F 240-050-3S01G 240-050-3S01X 240-050-3S01Y 240-050-3S01Z 240-050-3P01Z 240-050-3P01Y 240-050-3P01F 240-050-3P01X 240-050-3P01X020207020207 240-050-3S01D020207020207 240-050-3P01D020207020207
OCR Text ...450 thickness over Copper flash deposition per SAE-AMS-2418 Insulators: high grade rigid dielectric PC tail and solder cup contacts: Copper alloy/50" Gold over 50" Nickel 2. Assembly to be permanently identified with (space permitting) Glen...
Description FEMALE, MULTIWAY RACK AND PANEL CONN, SOLDER, RECEPTACLE
ARINC 600 Class A Size 3 Filter Receptacle

File Size 637.08K  /  2 Page

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    MV71001 MV71002 MV71003 MV71004 MV71005 MV71006 MV71007 MV71008 MV71009 MV71010 MV71011 MV71012 MV71013

Microsemi Corporation
Part No. MV71001 MV71002 MV71003 MV71004 MV71005 MV71006 MV71007 MV71008 MV71009 MV71010 MV71011 MV71012 MV71013
OCR Text ...s grown at using Chemical Vapor deposition. The layers are processed at using proprietary techniques resulting in high Q factor and repeatable tuning curves. The diodes are available in a variety of microwave ceramic packages or chips for o...
Description GaAs Multiplier Diodes Frequency Multiplier

File Size 149.46K  /  1 Page

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    1210B104XXX 1206Z104M250NXTM 0805N104XXX 1206B104XXX 1206Y104XXX 0805B104K500N 0805Y104XXX 1210N104XXX 1210D104XXX LS221

Electronic Theatre Controls, Inc.
Novacap
http://
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Part No. 1210B104XXX 1206Z104M250NXTM 0805N104XXX 1206B104XXX 1206Y104XXX 0805B104K500N 0805Y104XXX 1210N104XXX 1210D104XXX LS2211 0805B104XXX 1206N272XXX
OCR Text ... controlled by the solder paste deposition on the circuit pads. Pads are designed to match or slightly exceed the width of the capacitor, with length .030" (.760 mm) greater than the chip terminal band width, to provide a wetting area for a...
Description Circular Connector; Body Material:Aluminum; Series:PT06; No. of Contacts:24; Connector Shell Size:20; Connecting Termination:Solder; Circular Shell Style:Straight Plug; Circular Contact Gender:Socket; Insert Arrangement:20-24
Multilayer Ceramic Chip Capacitors
CERAMIC MULTILAYER CAPACITORS

File Size 2,581.28K  /  52 Page

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    C9732DK-11

Hamamatsu Corporation
Part No. C9732DK-11
OCR Text ...rray USB 2.0, 14-bit TTL Direct deposition CsI Unit m mm pixels pixels - Absolute maximum ratings (Ta=25 C) Parameter Supply voltage for digital circuitry (+5 V) Supply voltage for analog circuitry (+5 V) Operating temperature *1 Storag...
Description For soft X-ray imaging, cassette type with USB 2.0 interface Large photodiode area: 120 ? 120 mm
For soft X-ray imaging, cassette type with USB 2.0 interface Large photodiode area: 120 × 120 mm

File Size 876.71K  /  6 Page

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    MA4MV4

M/A-COM Technology Solutions, Inc.
Part No. MA4MV4
OCR Text ...g a low pressure chemical vapor deposition (LPCVD) that results in dense, uniform nitride layers. These devices exhibit higher capacitance per unit area (resulting in smaller chip size) and improved ruggedness over similar MOS, MIS and cera...
Description MNS Microwave Chip Capacitors

File Size 131.83K  /  4 Page

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    NOVACAP
Part No. 0805Y104XXX 0805Z104XXX 1206X104XXX 1206Z104 1206Z104M250NXTM 1206Z104XXX 1206N272XXX
OCR Text ... controlled by the solder paste deposition on the circuit pads. Pads are designed to match or slightly exceed the width of the capacitor, with length .030" (.760 mm) greater than the chip terminal band width, to provide a wetting area for a...
Description CERAMIC MULTILAYER CAPACITORS

File Size 2,558.58K  /  52 Page

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    Omega
Part No. F3105
OCR Text ...nhanced by locating the winding deposition only 0.007" beneath the mounting surface. The rugged ceramic body, with firmly strain relieved 0.015" diameter platinum, is designed to withstand high vibration conditions. This versatile 100 ohm u...
Description Thinfilm RTD Elements

File Size 403.78K  /  3 Page

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    Alpha
Part No. DMJXXXX
OCR Text ...er mixer diodes are made by the deposition of a suitable barrier metal on an epitaxial silicon substrate to form the junction. The process and choice of materials result in low series resistance along with a narrow spread of capacitance val...
Description Silicon Beam-Lead and Chip Schottky Barrier Mixer Diodes

File Size 151.16K  /  8 Page

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    PE3 SVC6310

MA-Com
Tyco Electronics
Part No. PE3 SVC6310
OCR Text ... Ohmic Boron Isolation Resistor deposition Gate Finger Gate Interconnect Top via Overlay Air-post Air-Span Back-via Final Passivation 29 ST Saw Street NOTE: Unused layer numbers are reserved for future use. GMAX - 900um FET Specifi...
Description 25-1000 MHz, GaAs foundry service PROCESS PE3
GAAS FOUNDRY SERVICES PROCESS PE3
GaAs Foundry Services PROCESS PE3

File Size 26.25K  /  2 Page

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