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Hitachi,Ltd.
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Part No. |
HD66751 HD66750
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OCR Text |
...3 tcp-158 bare chip yes yes yes bumped chip yes yes yes no. of pins 153 153 158 chip sizes 9.69 x 2.73 10.88 x 2.89 11.39 x 2.89 pad intervals 120 m m 120 m m 120 m m
hd66750/1 5 lcd family comparison (cont) items hd66724 hd66725 hd66... |
Description |
128 x 128-dot Graphics LCD Controller/Driver with Four-grayscale Functions
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File Size |
2,088.54K /
96 Page |
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it Online |
Download Datasheet
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ONSEMI
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Part No. |
NLAS4685
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OCR Text |
... is available in a 2.0 x 1.5 mm bumped die array, with a 3 x 4 arrangement of solder bumps. The pitch of the solder bumps is 0.5 mm for easy handling.
Features http://onsemi.com MARKING DIAGRAM
A1 Microbump-10 CASE 489AA A1
XXD
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Description |
Ultra-Low Resistance Dual SPDT Analog Switch
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File Size |
77.60K /
10 Page |
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it Online |
Download Datasheet
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意法半导
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Part No. |
L6440
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OCR Text |
...unction. order code flip chip (bumped die) part number package operating temp. range l6440 flip chip (bumped die) -25c to +85c www.st.com
revision history l6440 2/3 1 revision history table 1. document revision history date... |
Description |
4-Channel ultra low power GMR-TMR preamplifier for HDD applications
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File Size |
51.04K /
3 Page |
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it Online |
Download Datasheet
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Price and Availability
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