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Maxim Integrated Products, Inc. MAXIM[Maxim Integrated Products] MAXIM - Dallas Semiconductor
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Part No. |
DSTINIS400 DSTINIS-005 DSTINIS-006
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OCR Text |
...206) 49.9W, 1% resistors (1206) 47w resistor (1206) 22.1kW, 1% resistor (1206) 220W resistors (1206) 10kW resistor (1206) Pad jumper DESIGNATION R20 R21 R22, R23 R24 QTY 1 1 2 1 DESCRIPTION 47kW resistor (1206) 124W, 1% resistor (1206) 1kW ... |
Description |
DSTINIs400/DSTINIx-00x插座 Sockets Evaluation Board
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File Size |
648.14K /
11 Page |
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Filtronic Compound Semi... FILTRONIC[Filtronic Compound Semiconductors]
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Part No. |
FMA219
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OCR Text |
...= 0.6 - (0.004 x (55 - 22)) = 0.47w * For optimum heatsinking eutectic die attach is recommended; conductive epoxy die attach is acceptable with some degradation in thermal de-rating performance (PTOT = 550mW) * Note on Thermal Resistivity:... |
Description |
X-BAND LNA MMIC
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File Size |
325.92K /
5 Page |
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FILTRONIC[Filtronic Compound Semiconductors]
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Part No. |
FMA411
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OCR Text |
...= 0.6 - (0.004 x (55 - 22)) = 0.47w * For optimum heatsinking eutectic die attach is recommended; conductive epoxy die attach is acceptable with some degradation in thermal de-rating performance (PTOT = 550mW) * Note on Thermal Resistivity:... |
Description |
LOW-NOISE X-BAND MMIC
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File Size |
224.97K /
3 Page |
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INTERSIL[Intersil Corporation] Intersil, Corp.
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Part No. |
HCS244MS HCS244D HCS244DMSR HCS244HMSR HCS244K HCS244KMSR FN2132 HCS244D/SAMPLE HCS244K/SAMPLE 5962R9573101VXC
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OCR Text |
.... . . . . . . . . . . . . . . 0.47w If device power exceeds package dissipation capability, provide heat sinking or derate linearly at the following rate: SBDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.9mW/oC Ce... |
Description |
Radiation Hardened Octal Buffer/Line Driver/ Three-State Radiation Hardened Octal Buffer/Line Driver, Three-State From old datasheet system CONTACT RACK & PANEL SOLDER EYE HC/UH SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, CDFP20
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File Size |
172.19K /
10 Page |
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INTERSIL[Intersil Corporation]
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Part No. |
HCS273MS HCS273KMSR FN2475
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OCR Text |
.... . . . . . . . . . . . . . . 0.47w If device power exceeds package dissipation capability, provide heat sinking or derate linearly at the following rate: SBDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.9mW/oC Ce... |
Description |
From old datasheet system Radiation Hardened Octal D Flip-Flop
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File Size |
138.57K /
9 Page |
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it Online |
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