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Amphenol Communications Solutions |
| Part No. |
10127819-14221LF
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| Description |
Minitek® Pwr 4.2, Dual Row, Right Angle Through Hole Header, 100u\\ Bright Tin plating, Black Color, 14 Positions, Non GW Compatible Nylon66, Tray Packing.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10131319-14221G0LF
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| Description |
Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Black Color, 14 Positions, GW Compatible Nylon66, Tray Packing.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
74221-201LF
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| Description |
400 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68422-127HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 27 Positions, 2.54mm Pitch, Vertical, 8.08mm (0.318in) Mating, 5.41mm (0.213in) Tail.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
G14A42211612HR
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| Description |
OCULINK RECEPTACLE Vertical SMT shell leg DIP length 2.9mm tape and reel package
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
G874D242212EU
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| Description |
Mini power, Right Angle, Dual row, 4.2mm pitch, 24 positions , 100u\\ Tin, 3.60mm tail length, LCP, Natural , TRAY
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77311-422-19LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10125756-A42210LF
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| Description |
PCI Express® GEN 3 Card Edge, Storage and Server Connector, Straddle-Mount, x16, 164 Positions, 1.00mm (0.039in) Pitch
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
73644-2210 0736442210
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| Description |
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position F, 72 Circuits
2.00mm (.079") Pitch HDM垄莽 Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position F, 72 Circuits
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| File Size |
174.19K /
4 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10131319-0422100LF
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| Description |
Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Black Color, 4 Positions, Non GW Compatible Nylon66, Tray Packing.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87914-2216 0879142216
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
3,779.50K /
48 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68422-124HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 24 Positions, 2.54mm Pitch, Vertical, 8.08mm (0.318in) Mating, 5.41mm (0.213in) Tail.
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Official Product Page
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Bom2Buy.com
Price and Availability
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