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  TIM-5510 Datasheet PDF File

For TIM-5510 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    TIM1314-9L

Toshiba Semiconductor
Part No. TIM1314-9L
Description IM3(Min.)=−25dBc at Po=33dBm Single Carrier Level

File Size 150.95K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-T1109LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 9 Positions, 2.54 mm Pitch, Right Angle
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    TIM1112-8

TOSHIBA[Toshiba Semiconductor]
Part No. TIM1112-8
Description MICROWAVE POWER GaAs FET

File Size 111.03K  /  4 Page

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Amphenol Communications Solutions

Part No. 55102-G1110LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 20 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    TOSHIBA[Toshiba Semiconductor]
Part No. TIM0910-2
Description MICROWAVE POWER GaAs FET

File Size 147.26K  /  5 Page

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Amphenol Communications Solutions

Part No. 55101-T1108LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 8 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    TIM1213-5

Toshiba Semiconductor
Part No. TIM1213-5
Description MICROWAVE POWER GaAs FET

File Size 84.12K  /  2 Page

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Amphenol Communications Solutions

Part No. 55101-S3620LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 20 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    TOSHIBA[Toshiba Semiconductor]
Part No. TIM0910-8
Description MICROWAVE POWER GaAS FET

File Size 148.22K  /  5 Page

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Amphenol Communications Solutions

Part No. 55101-G17-04
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 4 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
Part No. TIM1011-4L
Description MICROWAVE POWER GaAs FET

File Size 145.86K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-T1104LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 4 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
Part No. TIM1011-5L
Description MICROWAVE POWER GaAs FET

File Size 133.39K  /  5 Page

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Amphenol Communications Solutions

Part No. 55101-T1113LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 13 Positions, 2.54 mm Pitch, Right Angle
Tech specs    

Official Product Page

    TIM1112-4

Toshiba Semiconductor
Part No. TIM1112-4
Description MICROWAVE POWER GaAs FET

File Size 155.58K  /  5 Page

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Amphenol Communications Solutions

Part No. 55102-G1703LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 6 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    TIM1112-2

Toshiba Semiconductor
Part No. TIM1112-2
Description MICROWAVE POWER GaAs FET

File Size 153.41K  /  5 Page

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Amphenol Communications Solutions

Part No. 55101-S1120LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 20 Positions, 2.54 mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    TIM7785-16

TOSHIBA[Toshiba Semiconductor]
Part No. TIM7785-16
Description MICROWAVE POWER GAAS FET

File Size 149.61K  /  5 Page

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Amphenol Communications Solutions

Part No. 55101-T1102LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 2 Positions, 2.54 mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

For TIM-5510 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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