mass pdf Datasheet P6 Full Text Search --- IC-ON-LINE


	Part Number	Hot Search : SN8P1 LBT93002 K0303 M3H76TAD 4400B MAX9744 SDR1210 248YF
	Product Description
	Full Text Search

mass Datasheet PDF File

For mass Found Datasheets File :: 20265 Search Time::1.891ms
Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

				SONY[Sony Corporation]
Part No.	CXA1511L CXA1511M CXA1511L/M
OCR Text	...TREATMENT LEAD MATERIAL PACKAGE mass EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.7g CXA1511M + 0.4 5.0 - 0.1 8 5 8PIN SOP (PLASTIC) + 0.4 1.25 - 0.15 0.10 A + 0.3 4.4 - 0.1 6.4 0.4 + 0.15 0.1 - 0.1 0.5 0.2 0 to 10 (0.15) + 0.1 0.15 ...
Description	Preamplifier for Remote Control Signal Reception(前置放大器（用于远程信号接收 Preamplifier for Remote Control Signal Reception Remote Control IC
File Size	135.75K / 7 Page	View it Online	Download Datasheet

				SONY[Sony Corporation]
Part No.	CXA1684M
OCR Text	...TREATMENT LEAD MATERIAL PACKAGE mass EPOXY RESIN SOLDER/PALLADIUM PLATING 42/COPPER ALLOY 0.1g NOTE : PALLADIUM PLATING This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame). --6-- 0.5 0.2 B 6.4 0.4 + 0.15...
Description	High-Speed Transimpedance Amplifier
File Size	93.82K / 6 Page	View it Online	Download Datasheet

				SONY[Sony Corporation]
Part No.	CXA1685M
OCR Text	...TREATMENT LEAD MATERIAL PACKAGE mass EPOXY RESIN SOLDER/PALLADIUM PLATING 42/COPPER ALLOY 0.1g NOTE : PALLADIUM PLATING This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame). -8- 0.5 0.2 B 6.4 0.4 + 0.15 0...
Description	High-Speed Transimpedance Amplifier
File Size	105.29K / 8 Page	View it Online	Download Datasheet

				SONY[Sony Corporation]
Part No.	CXA1994 CXA1994AM CXA1994BM CXA1994AM/BM
OCR Text	...TREATMENT LEAD MATERIAL PACKAGE mass EPOXY RESIN SOLDER/PALLADIUM PLATING 42/COPPER ALLOY 0.1g NOTE : PALLADIUM PLATING This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame). CXA1994BM + 0.4 6.1 - 0.1 8PIN SOP (PL...
Description	M-ary FSK Demodulating Comparator M-ary FSK Demodulating Comparator Low Power 5V RS232 Dual Driver/Receiver with 0.1?μF Capacitors; Package: SO; No of Pins: 16; Temperature Range: -40?°C to 85?°C
File Size	118.20K / 8 Page	View it Online	Download Datasheet

				SONY[Sony Corporation]
Part No.	CXA2566M
OCR Text	...DE EIAJ CODE JEDEC CODE PACKAGE mass SOP-16P-L01 SOP016-P-0300 LEAD MATERIAL COPPER ALLOY 0.2g LEAD TREATMENT EPOXY RESIN SOLDER PLATING - 12 - 0.5 0.2 1 8 6.9
Description	Headphone Stereos
File Size	151.96K / 12 Page	View it Online	Download Datasheet

				SONY[Sony Corporation]
Part No.	CXL1503M CXL1505M
OCR Text	...TREATMENT LEAD MATERIAL PACKAGE mass EPOXY RESIN SOLDER PLATING 42/COPPER ALLOY 0.3g -9- 0.5 0.2 1 0.45 0.1 12 6.9 + 0.1 0.2 - 0.05 1.27
Description	CMOS-CCD Signal Processor
File Size	178.07K / 9 Page	View it Online	Download Datasheet

				SONY[Sony Corporation]
Part No.	CXL1504M
OCR Text	...TREATMENT LEAD MATERIAL PACKAGE mass EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.3g -9- 0.5 0.2 1 0.45 0.1 10 6.9 + 0.1 0.2 - 0.05
Description	CMOS-CCD 1H Delay Line for NTSC
File Size	111.86K / 9 Page	View it Online	Download Datasheet

				Sony, Corp. SONY[Sony Corporation]
Part No.	CXL5504M CXL5504P
OCR Text	...TREATMENT LEAD MATERIAL PACKAGE mass EPOXY RESIN SOLDER PLATING 42/COPPER ALLOY 0.1g 8PIN SOP (PLASTIC) 6.2 0.3 8 5 S 0.15 S 5.3 0.3 7.8 0.4 A 1 0.4 0.1 4 + 0.05 0.15 - 0.02 1.27 0.05 MIN 0.13 M S 10 ...
Description	CMOS-CCD 1H Delay Line for NTSC CMOS与CCD延迟线上半年对NTSC
File Size	133.95K / 11 Page	View it Online	Download Datasheet

				SONY[Sony Corporation]
Part No.	CXL5505M CXL5505P
OCR Text	...TREATMENT LEAD MATERIAL PACKAGE mass EPOXY RESIN SOLDER PLATING 42/COPPER ALLOY 0.2g CXL5505P 14PIN DIP (PLASTIC) + 0.4 19.2 - 0.1 14 8 7.62 + 0.3 6.4 - 0.1 + 0.1 05 0.25 - 0. 0 to 15 EPOXY RESIN SOLDER PLATING 42/COPP...
Description	CMOS-CCD 1H Delay Line for PAL
File Size	124.17K / 9 Page	View it Online	Download Datasheet

				SONY[Sony Corporation]
Part No.	CXL5506M CXL5506P
OCR Text	...TREATMENT LEAD MATERIAL PACKAGE mass EPOXY RESIN SOLDER PLATING 42/COPPER ALLOY 0.1g CXL5506P 8PIN DIP (PLASTIC) 8 5 7.62 + 0.3 6.4 - 0.1 + 0.4 9.4 - 0.1 + 0.1 0.05 0.25 - 0 to 15 EPOXY RESIN SOLDER PLATING COPPER AL...
Description	CMOS-CCD 1H Delay Line for PAL
File Size	106.48K / 9 Page	View it Online	Download Datasheet

For mass Found Datasheets File :: 20265 Search Time::1.891ms
Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |