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For exposed Found Datasheets File :: 19546 Search Time::2.563ms
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				Peregrine Semiconductor Corp.
Part No.	PE43502
OCR Text	...e+07 1.0e+08 1.0e+09 hz pin dbm exposed solder pad gnd vdd p/s gnd gnd le clk si c4 c2 c1 c 0.5 c8 rf1 24 23 22 21 20 19 18 17 16 15 14 13 2 3 4 5 6 1 gnd rf2 gnd gnd gnd gnd gnd gnd gnd gnd 7 8 9 10 11 12 table 2. pin descriptions figure...
Description	50 Ω RF Digital Attenuator
File Size	439.11K / 11 Page	View it Online	Download Datasheet

				Peregrine Semiconductor
Part No.	PE4350214
OCR Text	...e+07 1.0e+08 1.0e+09 hz pin dbm exposed solder pad gnd vdd p/s gnd gnd le clk si c4 c2 c1 c 0.5 c8 rf1 24 23 22 21 20 19 18 17 16 15 14 13 2 3 4 5 6 1 gnd rf2 gnd gnd gnd gnd gnd gnd gnd gnd 7 8 9 10 11 12 table 2. pin descriptions figure...
Description	50 Ω RF Digital Attenuator
File Size	981.14K / 11 Page	View it Online	Download Datasheet

				Maxim Integrated Products
Part No.	MAX17007AGTI MAX17007A
OCR Text	...x 4mm, thin QFN package with an exposed backside pad. Ordering Information PART MAX17007AGTI+ TEMP RANGE -40C to +105C PIN-PACKAGE 28 Thin QFN-EP* MAX17008GTI+ -40C to +105C 28 Thin QFN-EP* +Denotes a lead-free/RoHS-compliant package...
Description	Dual and Combinable QPWM Graphics Core Controllers for Notebook Computers
File Size	706.60K / 36 Page	View it Online	Download Datasheet

				NXP Semiconductors
Part No.	SA58631TK
OCR Text	...-pin HVSON package which has an exposed die attach paddle enabling reduced thermal resistance and increased power dissipation. 2. Features I I I I I I I I I Low junction-to-ambient thermal resistance using exposed die attach paddle Gain...
Description	3 W BTL audio amplifier
File Size	117.07K / 21 Page	View it Online	Download Datasheet

				NXP Semiconductors
Part No.	SA58670ABS
OCR Text	... in an HVQFN20 package with the exposed Die Attach Paddle (DAP). The SA58670A features independent shutdown controls for each channel. The gain may be set at 6 dB, 12 dB, 18 dB or 24 dB with gain select pins G0 and G1. Improved immunity to ...
Description	2.1 W/channel stereo class-D audio amplifier
File Size	156.99K / 24 Page	View it Online	Download Datasheet

				Linear Technology
Part No.	LT3573 LT3573EMSE-PBF LT3573EMSE-TRPBF LT3573IMSE-PBF LT3573IMSE-TRPBF 3573
OCR Text	... = 125C, JA = 50C/W, JC = 10C/W exposed PAD (PIN 17) IS GND, MUST BE CONNECTED TO GND ORDER INFORMATION LEAD FREE FINISH LT3573EMSE#PBF LT3573IMSE#PBF TAPE AND REEL LT3573EMSE#TRPBF LT3573IMSE#TRPBF PART MARKING* 3573 3573 PACKAGE DESCR...
Description	Isolated Flyback Converter Without an Opto-Coupler
File Size	239.25K / 24 Page	View it Online	Download Datasheet

				Monolithic Power Systems MONOLITHIC POWER SYSTEMS INC
Part No.	MP2214 MP2214DL
OCR Text	...4-lead qfn and 8-lead soic with exposed pad packages. features ? 4a output current ? input supply range: 3v to 16v ? 80m ? internal power mosfet switches ? all ceramic output capacitors design ? up to 95% efficiency ? 6...
Description	16V, 4A, 600kHz Synchronous Step-Down Converter SWITCHING REGULATOR, 750 kHz SWITCHING FREQ-MAX, PDSO14
File Size	341.70K / 12 Page	View it Online	Download Datasheet

				Linear Technology
Part No.	LT3483EDC-PBF LT3483ES6-PBF LT3483IDC-PBF LT3483IS6-PBF LT3483EDC LT3483EDC-TR LT3483ES6-TRPBF LT3483EDC-TRPBF
OCR Text	...C DFN TJMAX = 125C, JA = 121C/W exposed PAD (PIN 9) IS GND ORDER INFORMATION LEAD FREE FINISH LT3483EDC#PBF LT3483ES6#PBF LT3483IDC#PBF LT3483IS6#PBF LEAD BASED FINISH LT3483EDC LT3483ES6 TAPE AND REEL LT3483EDC#TRPBF LT3483ES6#TRPBF LT...
Description	Inverting Micropower DC/DC Converter with Schottky
File Size	143.44K / 12 Page	View it Online	Download Datasheet

				STMicroelectronics
Part No.	STLA01
OCR Text	... Table 2. Pin n 1 2 3 4 5 6 exposed Pad Pin description Symbol GND NC LED VCC PROG EN GND Ground Not connected This pin provide an accurate output limited current. In shutdown mode no current can flow to the LED. Input supply voltag...
Description	50 mA stand-alone linear LED driver
File Size	241.58K / 16 Page	View it Online	Download Datasheet

				Sanyo Semicon Device
Part No.	ENA1172 LV8761V
OCR Text	... 1.0 0.5 0 - 20 1 With exposed Die-Pad substrate 2 Without exposed Die-Pad 0 20 40 60 80 100 Ambient temperature, Ta - C Substrate Specifications (Substrate recommended for operation of LV8761T) Size : 90mm x 90mm x 1.6mm (...
Description	Bi-CMOS LSI Forward/Reverse H-bridge Driver
File Size	118.53K / 12 Page	View it Online	Download Datasheet

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