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Samsung Electronic
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Part No. |
KS0708
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OCR Text |
...S process U Package : available bumped chip
M/M-96-D001 97-09-19
1
PRELIMINARY SPECIFICATION
KS0708
BLOCK DIAGRAM
64COM/128SEG DRIVE FOR DOT MATRIX LCD
C1 ... C32
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S1 S2
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S63 S64 S65 S66
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Description |
64COM/128SEG DRIVE FOR DOT MATRIX LCD
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File Size |
211.69K /
27 Page |
View
it Online |
Download Datasheet
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Microsemi
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Part No. |
AAP662
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OCR Text |
...with a 6db gain. packaging is bumped chip scale smd configuration with a size of 930 m x 580 m and an overall thickness of 320 m (including solder bumps). optimum for small diameter microphones, the die is rohs compliant, with lead... |
Description |
Electret Condenser Microphone (ECM) Analog Pre-amplifiers
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File Size |
163.69K /
5 Page |
View
it Online |
Download Datasheet
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Price and Availability
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