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  91577-1314 Datasheet PDF File

For 91577-1314 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    TOSHIBA
Part No. 2SA1314
Description Transistor Silicon PNP Epitaxial Type (PCT process) Strobe Flash Applications Audio Power Applications

File Size 144.00K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-4218-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Double End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    EIM1314-4

Excelics Semiconductor, Inc.
Part No. EIM1314-4
Description 13.75-14.50GHz Multi-Stage Power Amplifier

File Size 132.10K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-4614-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    2SA1314

Guangdong Kexin Industrial Co.,Ltd
Part No. 2SA1314
Description Audio Power Applications

File Size 348.67K  /  2 Page

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Amphenol Communications Solutions

Part No. 131-4316-11H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Left End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    TIM1314-9L

Toshiba Semiconductor
Part No. TIM1314-9L
Description IM3(Min.)=−25dBc at Po=33dBm Single Carrier Level

File Size 150.95K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-4618-11H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Right Polarized, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    SB1314E-H

AUK corp
Part No. SB1314E-H
Description SB1314E-H
Chip LED

File Size 240.42K  /  5 Page

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Amphenol Communications Solutions

Part No. 131-4414-21D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Right End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    EIC1314-4

Excelics Semiconductor, Inc.
Part No. EIC1314-4
Description 13.75-14.50GHz 4-Watt Internally-Matched Power FET

File Size 173.27K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-4116-21H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

    EIC1314-2

Excelics Semiconductor, Inc.
Part No. EIC1314-2
Description 13.75-14.50GHz 2-Watt Internally-Matched Power FET

File Size 114.39K  /  2 Page

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Amphenol Communications Solutions

Part No. 131-4418-21H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Right End Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

    Sony, Corp.
Part No. HV1314P
Description Interface IC 接口IC

File Size 139.39K  /  5 Page

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Amphenol Communications Solutions

Part No. 131-4316-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Left End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    Motorola Semiconductor
Part No. MC13141
Description Low Power DC - LNA and Mixer

File Size 504.97K  /  9 Page

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Amphenol Communications Solutions

Part No. 131-4618-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    EIM1314-5

Excelics Semiconductor, Inc.
Part No. EIM1314-5
Description 13.75-14.50GHz Multi-Stage Power Amplifier

File Size 208.72K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-4414-11H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Right End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

For 91577-1314 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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