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  87914-3203 Datasheet PDF File

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    0879140816

Molex Electronics Ltd.
Part No. 0879140816
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
File Size 3,779.31K  /  48 Page

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Amphenol Communications Solutions
Part No. 75844-879-14LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    0879140009

Molex Electronics Ltd.
Part No. 0879140009
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 6 Circuits, Gold (Au) Flash Overall Plating, Tray Packaging, Lead-free
File Size 3,779.28K  /  48 Page

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Amphenol Communications Solutions
Part No. 73933-2034LF
Description Metral® Board Connectors, Backplane Connectors 5 Row Signal Header, Straight, 5 Mod, Press Fit.
Tech specs 　 　

Official Product Page

    0879144204

Molex Electronics Ltd.
Part No. 0879144204
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 42 Circuits, 0.38μm (15μ) Gold (Au) Plating, Tray Packaging, Lead-free
File Size 4,416.61K  /  57 Page

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Amphenol Communications Solutions
Part No. 51700-10303203ACLF
Description PwrBlade®, Power Supply Connectors, 3P 32S 3P STB Vertical Header.
Tech specs 　 　

Official Product Page

    87914-8016 0879148016

Molex Electronics Ltd.
Part No. 87914-8016 0879148016
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 80 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Lead-free
File Size 3,779.54K  /  48 Page

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Amphenol Communications Solutions
Part No. 69173-203HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 3 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    0879142016

Molex Electronics Ltd.
Part No. 0879142016
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 20 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
File Size 3,779.31K  /  48 Page

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Amphenol Communications Solutions
Part No. 73983-2031LF
Description Metral® High Speed 1000 Series, Backplane Connectors, Header, Vertical Signal, 5 Row, Press-Fit, 30 Position, Select Load, Standard
Tech specs 　 　

Official Product Page

    0879142416 87914-2416

Molex Electronics Ltd.
Part No. 0879142416 87914-2416
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 24 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
File Size 3,779.31K  /  48 Page

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Amphenol Communications Solutions
Part No. 61083-203600LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 200 Positions.
Tech specs 　 　

Official Product Page

    87914-2616 0879142616

Molex Electronics Ltd.
Part No. 87914-2616 0879142616
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 26 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
File Size 3,779.31K  /  48 Page

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Amphenol Communications Solutions
Part No. 61083-203609LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 200 Positions.
Tech specs 　 　

Official Product Page

    AT-32011 AT-32011-BLK AT-32011-TR1 AT-32033 AT-32033-BLK AT-32033-TR1

HP[Agilent(Hewlett-Packard)]
Agilent (Hewlett-Packard)
Part No. AT-32011 AT-32011-BLK AT-32011-TR1 AT-32033 AT-32033-BLK AT-32033-TR1
Description Low Current/ High Performance NPN Silicon Bipolar Transistor
Low Current, High Performance NPN Silicon Bipolar Transistor
File Size 109.04K  /  10 Page

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Amphenol Communications Solutions
Part No. 59202-T32-03A085LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 6 Positions.
Tech specs 　 　

Official Product Page

    CN13203

Cree, Inc
Part No. CN13203
Description Lenina series
File Size 408.21K  /  6 Page

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Amphenol Communications Solutions
Part No. 10083113-203LF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded vertical header ,Press Fit ,Single row , 3 Positions ,2.54mm (0.100in) Pitch..
Tech specs 　 　

Official Product Page

    TLP3203

Toshiba Semiconductor
Part No. TLP3203
Description PHOTOCOUPLER PHOTO RELAY
File Size 192.02K  /  7 Page

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Amphenol Communications Solutions
Part No. 10114828-13203LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 3 Positions
Tech specs 　 　

Official Product Page

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