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  54112-109-05-1250 Datasheet PDF File

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    VPS20-1250

TRIAD MAGNETICS
Part No. VPS20-1250
Description
File Size 110.85K  /  1 Page

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Amphenol Communications Solutions

Part No. 54112-112502500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    TOKO, Inc.
Part No. C.PI-1050-0R6S C.PI-1250-0R6S
Description 1 ELEMENT, 0.55 uH, GENERAL PURPOSE INDUCTOR, SMD ROHS COMPLIANT

File Size 205.67K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-405201250LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    ARIES ELECTRONICS INC
Part No. 12-81250-610C
Description DIP12, IC SOCKET

File Size 670.92K  /  1 Page

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Amphenol Communications Solutions

Part No. 54112-807161250LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

   
Part No. FT600-1250-2
Description ELECTRIC FUSE, 1.25A, 600VAC, 250A (IR), SURFACE MOUNT

File Size 346.97K  /  5 Page

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Amphenol Communications Solutions

Part No. 54112-809401250LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    T-11-1250-P3-MSC T-11-1250-R3-MSC T-11-1250-P3-MST T-11-1250-R3-MST T-11-1250-P3-SSC T-11-1250-P3-SFC T-11-1250-P3-SST T

Source Photonics, Inc.
Panasonic, Corp.
Part No. T-11-1250-P3-MSC T-11-1250-R3-MSC T-11-1250-P3-MST T-11-1250-R3-MST T-11-1250-P3-SSC T-11-1250-P3-SFC T-11-1250-P3-SST T-11-1250-P3-MFC T-11-1250-R3-SSC T-11-1250-R3-SST T-11-1250-R3-MFC T-11-1250-R3-SFC T-11-1250-P3-SFC-O T-11-1250-P3-SFC-G5 T-11-1250-P3-SFC-O-GR T-11-1250-P3-SFC-O-G5 T-11-1250-R3-S-O-G5
Description PIN-TIA Receiver Modules-Receptacle & Pigtailed(3.3V)
FIBER OPTIC RECEIVER, 1100-1650nm, THROUGH HOLE MOUNT, FC/PC CONNECTOR ROHS COMPLIANT PACKAGE-4
FIBER OPTIC RECEIVER, 1100-1650nm, PANEL MOUNT, FC/PC CONNECTOR ROHS COMPLIANT PACKAGE-4
FIBER OPTIC RECEIVER, 1100-1650nm, THROUGH HOLE MOUNT, SC/PC CONNECTOR

File Size 414.29K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-508121270LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    MOLEX INC
Part No. 87758-1250
Description 2mm MGrid VHdr .38AuLF 12Ckt

File Size 104.89K  /  2 Page

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Amphenol Communications Solutions

Part No. 54112-107041250LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 4 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-1250

Molex Electronics Ltd.
Part No. 87759-1250
Description
File Size 174.22K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-808141250LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    FT600-1250

Tyco Electronics
Part No. FT600-1250
Description Telecom Fuse

File Size 78.72K  /  2 Page

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Amphenol Communications Solutions

Part No. 54112-107061250LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 6 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Molex
Part No. 51110-1250
Description Multipole Connector; Gender:Male; No. of Contacts:12; Series:Milli-Grid; Body Material:Glass-filled Polyester; No. of Rows:2; Pitch Spacing:0.079" RoHS Compliant: Yes

File Size 31.06K  /  1 Page

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Amphenol Communications Solutions

Part No. 54112-807201250LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    70287-1250

Molex Electronics Ltd.
Part No. 70287-1250
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 14 Circuits, 8.13mm (.320) Mating Pin Length, 0.76μm (30μ) Gold (Au) Selective

File Size 303.46K  /  5 Page

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Amphenol Communications Solutions

Part No. 54112-109401250LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

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