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  50210 Datasheet PDF File

For 50210 Found Datasheets File :: 80+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 |   

    0025021014 25-02-1014 A-70204-0326

Molex Electronics Ltd.
Part No. 0025021014 25-02-1014 A-70204-0326
Description 2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 14 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 222.18K  /  3 Page

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Amphenol Communications Solutions

Part No. 62684-502100ALF
Description 0.50mm Flex Connector, OPU Series, 50 Position , Side Entry, Upper Side Contact, Surface Mount, ZIF
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    HSP50210JC-52Z HSP50210JI-52Z

Intersil Corporation
Part No. HSP50210JC-52Z HSP50210JI-52Z
Description Digital Costas Loop

File Size 757.26K  /  51 Page

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Amphenol Communications Solutions

Part No. 84502-101LF
Description 300 Position BGA Receptacle, 5.5mm Component Height, 1.27mm x 1.27mm Array, Lead-free
Tech specs    

Official Product Page

    70018-0009 50-65-0210 0050650210

Molex Electronics Ltd.
Part No. 70018-0009 50-65-0210 0050650210
Description 2.54mm (.100) Pitch, SL Single Row Wire-to-Wire Panel Mount, 10 Circuits
2.54mm (.100") Pitch, SL Single Row Wire-to-Wire Panel Mount, 10 Circuits

File Size 187.55K  /  3 Page

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Amphenol Communications Solutions

Part No. L17TF2502104
Description Dsub, Stamped Signal 3A, Straight PCB Press-Fit, 25 Socket, Bright Tin Shell, 0.76um(30 in) Gold, M3 Threaded Rear Insert, Without Boardlock
Tech specs    

Official Product Page

    70204-0341 SDA-70204-0341 0025021044 25-02-1044

Molex Electronics Ltd.
Part No. 70204-0341 SDA-70204-0341 0025021044 25-02-1044
Description 2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 44 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 44 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 221.95K  /  3 Page

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Amphenol Communications Solutions

Part No. L17TF1502100
Description Dsub, Stamped Signal 3A, Straight PCB Press-Fit, 15 Socket, Bright Tin Shell, 0.76um(30 in) Gold, 3.05mm (0.120in) Clear Hole, Without Boardlock
Tech specs    

Official Product Page

    25-02-1030 0025021030 SDA-70204-0334

Molex Electronics Ltd.
Part No. 25-02-1030 0025021030 SDA-70204-0334
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 30 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 222.18K  /  3 Page

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Amphenol Communications Solutions

Part No. L17TF1502102
Description Dsub, Stamped Signal 3A, Straight PCB Press-Fit, 15 Socket, Bright Tin Shell, 0.76um(30 in) Gold, 4-40 Threaded Rear Insert with 4-40 Screwlock Installed, Without Boardlock
Tech specs    

Official Product Page

    0025021028 25-02-1028 SDA-70204-0333

Molex Electronics Ltd.
Part No. 0025021028 25-02-1028 SDA-70204-0333
Description 2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 28 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 28 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 222.18K  /  3 Page

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Amphenol Communications Solutions

Part No. 95278-502-10LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 10 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    0025021024 25-02-1024 SDA-70204-0331

Molex Electronics Ltd.
Part No. 0025021024 25-02-1024 SDA-70204-0331
Description 2.54mm (.100

File Size 222.18K  /  3 Page

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Amphenol Communications Solutions

Part No. G846A502100T1HR
Description Board mount - Header Receptacle - Wire to Board 1.0mm Pitch Vertical SMT,2x25Pin,Gold Flash,NY4T,Latch Type,Color-Natural
Tech specs    

Official Product Page

    0025021032 SDA-70204-0335

Molex Electronics Ltd.
Part No. 0025021032 SDA-70204-0335
Description 2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 32 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 32 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 222.25K  /  3 Page

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Amphenol Communications Solutions

Part No. L17TF2502102
Description Dsub, Stamped Signal 3A, Straight PCB Press-Fit, 25 Socket, Bright Tin Shell, 0.76um(30 in) Gold, 4-40 Threaded Rear Insert with 4-40 Screwlock Installed, Without Boardlock
Tech specs    

Official Product Page

    0025021012 25-02-1012 SDA-70204-0325

Molex Electronics Ltd.
Part No. 0025021012 25-02-1012 SDA-70204-0325
Description 2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 12 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 12 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 222.25K  /  3 Page

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Amphenol Communications Solutions

Part No. 84502-101
Description 300 Position BGA Receptacle, 5.5mm Component Height, 1.27mm x 1.27mm Array
Tech specs    

Official Product Page

    MIC502105 MIC5021YM MIC5021YN

Micrel Semiconductor, Inc.
Part No. MIC502105 MIC5021YM MIC5021YN
Description Temperature Sensor IC; IC Function:Temperature Sensor IC; Package/Case:8-DIP; Mounting Type:Through Hole BUF OR INV BASED MOSFET DRIVER, PDIP8
Temperature Sensor IC; IC Function:Temperature Sensor IC; Package/Case:8-SOIC; Mounting Type:Surface Mount RoHS Compliant: Yes BUF OR INV BASED MOSFET DRIVER, PDSO8
High-Speed High-Side MOSFET Driver

File Size 203.49K  /  10 Page

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Amphenol Communications Solutions

Part No. L17TF2502100
Description Dsub, Stamped Signal 3A, Straight PCB Press-Fit, 25 Socket, Bright Tin Shell, 0.76um(30 in) Gold, 3.05mm (0.120in) Clear Hole, Without Boardlock
Tech specs    

Official Product Page

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