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Amphenol Communications Solutions |
Part No. |
54122-414281400LF
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Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 28 position, 2.54mm (0.100in) pitch
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
77428-124LF
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Description |
Metral® , Backplane Connectors, Power Insert, Receptacle, Straight, Crimp to Wire.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
0444281802 44428-1802
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Description |
3.00mm (.118) Pitch Micro-Fit 3.0 BMI?/a> Header, Surface Mount Compatible, DualRow, Right Angle, with Snap-in Plastic Peg PCB Lock, 18 Circuits, 0.38μm (15μ) Gold 3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, DualRow, Right Angle, with Snap-in Plastic Peg PCB Lock, 18 Circuits, 0.38μm (15μ) Gold MOLEX Connector
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File Size |
232.93K /
4 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
54242-810502000LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
87914-2815 0879142815
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75μm (30μ) Gold (Au) Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75渭m (30渭) Gold (Au) Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75楼矛m (30楼矛) Gold (Au) Plating, Tray Packaging, Lead-free
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File Size |
3,777.37K /
48 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
77428-134LF
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Description |
Metral® , Backplane Connectors, Power Insert, Receptacle, Straight, Crimp to Wire.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
77315-428-13LF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 13 Positions 2.54mm (0.100in) Pitch, Right Angle
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
87914-2816 0879142816
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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File Size |
3,779.54K /
48 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
54242-810122050LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54242-810142250LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
77428-125LF
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Description |
Metral® , Backplane Connectors, Power Insert, Receptacle, Straight, Crimp to Wire.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
77315-428-18LF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 18 Positions 2.54mm (0.100in) Pitch, Right Angle
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
77315-428-16LF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 16 Positions 2.54mm (0.100in) Pitch, Right Angle
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Tech specs |
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Official Product Page
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Bom2Buy.com

Price and Availability
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