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CREE[Cree, Inc]
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Part No. |
CRF24010D
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OCR Text |
...in microns)
Overall die size 1143 x 1067 (+/-25) microns, die thickness 300 microns All pads must be bonded for electrical connection (sources not connected to backside metal).
Assembly Notes: * Recommended solder is AuSn (80/20) sold... |
Description |
10 W SiC RF Power MESFET Die
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File Size |
724.75K /
8 Page |
View
it Online |
Download Datasheet
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ZCOMM[Z-Communications, Inc]
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Part No. |
CLV1185A
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OCR Text |
...-40
c c c
1106
1126
1143
1161
1179
1197
1216
1235
1255
FREQUENCY (MHz)
PHYSICAL DIMENSIONS
PIN CONFIGURATION P1 P2 P3 REST Vt RF Out VCC GROUND H 0.220 0.220 0.160 0.160 0.130 0.130
Z-COMM XXXXXXXX-LF W... |
Description |
VOLTAGE CONTROLLED OSCILLATOR
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File Size |
65.10K /
2 Page |
View
it Online |
Download Datasheet
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Price and Availability
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