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  STB60NE03L-12T4 Datasheet PDF File

For STB60NE03L-12T4 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    SK10GD12T4ET

Semikron International
Part No. SK10GD12T4ET
Description IGBT Module

File Size 803.83K  /  5 Page

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Amphenol Communications Solutions

Part No. 20021212-00012T4LF
Description Minitek127®, Board/Wire to Board connector, Shrouded Right Angled Header, Through Hole, Double Row, 12 Positions, 1.27 mm (.050in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    SKM100GB12T4

Semikron International
Part No. SKM100GB12T4
Description IGBT Module

File Size 478.95K  /  5 Page

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Amphenol Communications Solutions

Part No. 59112-T40-07-150LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 14 Positions.
Tech specs    

Official Product Page

    SKM400GA12T4-13

Semikron International
Part No. SKM400GA12T4-13
Description Fast IGBT4 Modules

File Size 388.90K  /  5 Page

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Amphenol Communications Solutions

Part No. 59112-T40-18-140LF
Description Minitek® 2.00mm, Board to Board Connector, Unshrouded Stacking Header - Through Hole - Double row - 36 Positions - 2mm (0.079inch) - Vertical.
Tech specs    

Official Product Page

    SKM450GB12T4

Semikron International
Part No. SKM450GB12T4
Description Fast IGBT4 Modules

File Size 316.47K  /  6 Page

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Amphenol Communications Solutions

Part No. 20021611-00012T4LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 12 contacts
Tech specs    

Official Product Page

    38AC12T4V108

Semikron International
Part No. 38AC12T4V108
Description 3-phase bridge inverter

File Size 1,653.08K  /  5 Page

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Amphenol Communications Solutions

Part No. 59112-T40-11-143LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 22 Positions.
Tech specs    

Official Product Page

    BRL2012T4R7M

Taiyo Yuden (U.S.A.), Inc
Taiyo Yuden (U.S.A.), I...
Part No. BRL2012T4R7M
Description Wire-wound Chip Power Inductors (BR series)

File Size 125.77K  /  1 Page

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Amphenol Communications Solutions

Part No. 20021444-00012T4LF
Description Minitek127®, Wire to Board connector, IDC Receptacle, Double Row, 12 Positions, 1.27 mm (.050in) * 1.27 mm (.050in) Pitch.
Tech specs    

Official Product Page

    25AC12T4V108

Semikron International
Part No. 25AC12T4V108
Description 3-phase bridge inverter

File Size 1,424.88K  /  5 Page

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Amphenol Communications Solutions

Part No. 20021121-00012T4LF
Description Minitek127®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 12Positions, 1.27mm (0.5inch) pitch.
Tech specs    

Official Product Page

    11AC12T4V108

Semikron International
Part No. 11AC12T4V108
Description 3-phase bridge inverter

File Size 992.92K  /  5 Page

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Amphenol Communications Solutions

Part No. 20021122-00012T4LF
Description Minitek127® 1.27mm, Board To Board, Unshrouded header, Surface Mount, 12 contacts.
Tech specs    

Official Product Page

    24AC12T4V108

Semikron International
Part No. 24AC12T4V108
Description 3-phase bridge inverter

File Size 1,457.19K  /  5 Page

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Amphenol Communications Solutions

Part No. 20021621-00012T4LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 12 contacts
Tech specs    

Official Product Page

    SKM300GM12T4

Semikron International
Part No. SKM300GM12T4
Description Fast IGBT4 Modules

File Size 155.02K  /  5 Page

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Amphenol Communications Solutions

Part No. 20021521-00012T4LF
Description Minitek127®, Shrouded Board to Board Header, Surface Mount, 12 positions, 1.27mm (0.500in) pitch.
Tech specs    

Official Product Page

For STB60NE03L-12T4 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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