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MACOM[Tyco Electronics]
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Part No. |
EMDC-10-1_1 EMDC-10-1 EMDC-10-1TR EMDC-10-11
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OCR Text |
...ilable
EMDC-10-1 V4
SM - 22 Package
Description
M/A-COM's EMDC-10-1 is a broadband coupler in a low cost, surface mount package. It offers low loss, good isolation, good input/output matching and exceptional coupling repeatability. ... |
Description |
E-Series Coupler 5-1000 MHz
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File Size |
52.17K /
2 Page |
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it Online |
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ELPIDA[Elpida Memory]
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Part No. |
EDL5132CBMA-10-E EDL5132CBMA
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OCR Text |
...bits Mobile RAM MCP (Multi Chip Package) organized as 4,194,304 words x 32 bits x 4 banks, 2 pieces of 256M bits Mobile RAM in one package. ...10-E Organization (words x bits) 16M x 32 Internal banks 4 Clock frequency MHz (max.) 100 /CAS laten... |
Description |
512M bits Mobile RAM MCP 2 pcs of 256Mb components (16M words x 32 bits)
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File Size |
546.71K /
62 Page |
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it Online |
Download Datasheet |
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Mitsubishi
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Part No. |
MH64D72KLH-10 MH64D72KLH-75
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OCR Text |
...8 DDR Synchronous DRAMs in TSOP package , industry standard Registered Buffer in TSSOP package , and industry standard PLL in TSSOP package....10
4,831,838,208-BIT (67,108,864-WORD BY 72-BIT) Double Data Rate Synchronous DRAM Module
PIN CO... |
Description |
4 /831 /838 /208-BIT (67 /108 /864-WORD BY 72-BIT) Double Data Rate Synchronous DRAM Module
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File Size |
358.25K /
39 Page |
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it Online |
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Infineon Technologies A... INFINEON[Infineon Technologies AG]
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Part No. |
CLX34-10 CLX34 CLX34-00 CLX34-05
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OCR Text |
...etically sealed microwave power package Low thermal resistance for high voltage application Power added efficiency > 53 % Component Under De...10 (ql)
-
see below
G
MWP-25 tbc.
CLX34-nn: specifies output power level (see electri... |
Description |
HiRel X-Band GaAs Power-MESFET 伊雷X波段砷化镓功率场效应
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File Size |
611.20K /
9 Page |
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it Online |
Download Datasheet |
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Price and Availability
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