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  HOA0708-011 Datasheet PDF File

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    03-06-2011-P

Molex Electronics Ltd.
Part No. 03-06-2011-P
Description PLUG & RECEPTACLE HOUSINGS I CIRCUIT .062/(1.57) DIA. SERIES

File Size 119.36K  /  3 Page

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HUA FENG CIRCUIT





    21-0111

Maxim Integrated Products
Part No. 21-0111
Description PACKAGE OUTLINE, 8L SOIC,150 EXPOSED PAD

File Size 25.47K  /  1 Page

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    22-28-0110

Molex Electronics Ltd.
Part No. 22-28-0110
Description 2.54mm (.100) Pitch KK? Header, Breakaway, Vertical, with Friction Lock, 11 Circuits, Tin (Sn) Plating

File Size 167.49K  /  6 Page

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    CUI INC
Part No. PJ-011B
Description DC POWER JACK

File Size 20.84K  /  1 Page

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    21-0110

Dallas Semiconducotr
DALLAS[Dallas Semiconductor]
Part No. 21-0110
Description PACKAGE OUTLINE, 32L TQFP, 5x5x1.0mm

File Size 50.78K  /  2 Page

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    CUI INC
Part No. PJ-011A
Description DC POWER JACK

File Size 20.41K  /  1 Page

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    03-06-1011

Molex Electronics Ltd.
Part No. 03-06-1011
Description 1.57mm Diameter Standard .062 Pin and Socket Receptacle Housing, 1 Circuits

File Size 30.14K  /  2 Page

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    Molex, Inc.
Part No. 08-50-0113
Description Crimp Socket Contact; Wire Size (AWG):30-22; Contact Plating:Tin; Series:2759; Lead Pitch:2.54mm; Reel Quantity:10000; Voltage Rating:250V BRASS, TIN OVER NICKEL FINISH, WIRE TERMINAL

File Size 144.65K  /  2 Page

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    Asahi Kasei Microsystem...
Part No. HG-0113
Description    Shipped in packet-tape reel(5,000pcs per reel)

File Size 170.78K  /  3 Page

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    Asahi Kasei Microsystem...
Part No. HG-0112
Description    Shipped in packet-tape reel(5,000pcs per reel)

File Size 123.23K  /  3 Page

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