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				NXP Semiconductors PHILIPS[Philips Semiconductors]
Part No.	TDA8754 TDA8754H
OCR Text	...fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/co...
Description	Triple high speed ADC for LCD drive
File Size	76.97K / 8 Page	View it Online	Download Datasheet

				Sanyo Semicon Device
Part No.	LA4485
OCR Text	...o truss head machine screws and binding head machine screws stipulated by JIS for the mounting screws. Furthermore, washers must be used to protect the surface of the IC tab. Make sure that there is no foreign matter, such as cutting debris...
Description	5 W, Two-channel Power Amplifier with Very Few External Parts
File Size	494.95K / 20 Page	View it Online	Download Datasheet

				PHILIPS[Philips Semiconductors] NXP Semiconductors N.V.
Part No.	TDA7050T TDA7050T/N3 TDA7050T/N3/S6
OCR Text	...fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal ...
Description	TDA7050T; Low voltage mono/stereo power amplifier Low Voltage Mono/Stereo Power Amplifier(低压单声立体声功率放大器) 0.075 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO8
File Size	47.19K / 9 Page	View it Online	Download Datasheet

				PHILIPS[Philips Semiconductors] NXP Semiconductors
Part No.	74HC1G04 74HCT1G04 74HC1G04GW 74HC1G04GV 74HCT1G04GV 74HCT1G04GW
OCR Text	...fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection ...
Description	74HC1G04; 74HCT1G04; Inverter
File Size	68.07K / 16 Page	View it Online	Download Datasheet

				ADPOW[Advanced Power Technology] Advanced Power Technology Ltd.
Part No.	APT30GT60BRD
OCR Text	...ting Torque using a 6-32 or 3mm binding Head Machine Screw 1.1 052-6251 Rev B Repetitive Rating: Pulse width limited by maximum junction temperature. See MIL-STD-750 Method 3471 Switching losses include the FRED and IGBT. APT Reserves ...
Description	The Thunderbolt IGBT?/a> is a new generation of high voltage power IGBTs. Thunderbolt IGBT & FRED 600V 55A The Thunderbolt IGBT is a new generation of high voltage power IGBTs. The Thunderbolt IGBT⑩ is a new generation of high voltage power IGBTs. The Thunderbolt IGBTis a new generation of high voltage power IGBTs.
File Size	68.57K / 5 Page	View it Online	Download Datasheet

				Advanced Power Technology Ltd. ADPOW[Advanced Power Technology]
Part No.	APT30GT60BR
OCR Text	...ting Torque using a 6-32 or 3mm binding Head Machine Screw TYP MAX UNIT C/W lb*in 0.5 40 10 Repetitive Rating: Pulse width limited by maximum junction temperature. IC = IC2, VCC = 50V, RGE = 25, L = 100H, Tj = 25C See MIL-STD...
Description	The Thunderbolt IGBTis a new generation of high voltage power IGBTs. Thunderbolt IGBT 600V 58A The Thunderbolt IGBT is a new generation of high voltage power IGBTs. The Thunderbolt IGBT⑩ is a new generation of high voltage power IGBTs. The Thunderbolt IGBT?/a> is a new generation of high voltage power IGBTs.
File Size	24.51K / 2 Page	View it Online	Download Datasheet

				NXP Semiconductors PHILIPS[Philips Semiconductors]
Part No.	TDA7072A TDA7072AT TDA7072
OCR Text	...fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. TDA7072A/AT Several techniques exist for reflowing; for e...
Description	Single BTL power driver
File Size	72.72K / 10 Page	View it Online	Download Datasheet

				SIPEX[Sipex Corporation]
Part No.	SP6642CU SP6642EB SP6643 SP6642UEB
OCR Text	...rectly to external Power Supply binding post positive. VIN = +0.85 to +1.65V. Or, connect AAA Battery to clip labeled "+". GND - U1-6 - Connect GND post on bottom of board directly to external Power Supply binding post negative. Or, connect...
Description	Evaluation Board Manual
File Size	37.74K / 7 Page	View it Online	Download Datasheet

				Motorola, Inc
Part No.	MC68HC705BD3 MC68HC05BD3 MC68HC05BD5
OCR Text	...ble of contents Index Page size/binding Overall impression Poor t t t t t t t t t t t t t t t t t t t t t t t Not at all t t t t t t t t t t t t t t t t t t t t 2. What is your intended use for this document? ...
Description	HCMOS microcontroller
File Size	799.53K / 112 Page	View it Online	Download Datasheet

				Philips Semiconductors
Part No.	74LVC1G04 74LVC1G04GW
OCR Text	...fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection ...
Description	Single inverter
File Size	63.19K / 12 Page	View it Online	Download Datasheet

For binding Found Datasheets File :: 5860 Search Time::2.594ms
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