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  35979-0450 Datasheet PDF File

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    Molex Electronics
Part No. 70450-0052
Description 2.54mm (.100) Pitch SL Crimp Housing Dual Row Version B Polarized 8 Circuits

File Size 144.17K  /  2 Page

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Amphenol Communications Solutions

Part No. 77317-804-50LF
Description BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 50 Positions ,2.54mm (0.100in) Pitch,
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Molex Electronics
Part No. 70450-0003
Description 2.54mm (.100) Pitch SL Crimp Housing Dual Row Version A Nonpolarized 8 Circuits

File Size 139.55K  /  2 Page

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Amphenol Communications Solutions

Part No. 98414-G04-50ULF
Description Shrouded Header - Through Mount - Double row - 50 Positions - 2.00mm (0.079inch) - Vertical
Tech specs    

Official Product Page

    70280-0450

Molex Electronics Ltd.
Part No. 70280-0450
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, HighTemperature, 84 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail

File Size 283.67K  /  4 Page

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Amphenol Communications Solutions

Part No. 67045-026LF
Description Quickie®, Wire To Board, Strain Relief, 26 Positions
Tech specs    

Official Product Page

    750450

Tyco Electronics
Part No. 750450
Description Connector - D-Shell Connector - Cable Mount

File Size 158.75K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-804500800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    22-304504-18-P

Aries Electronics, Inc.
Part No. 22-304504-18-P
Description 24-Pin SOIC-to-22-Pin 0.400 DIP
24-Pin SOIC-to-22-Pin 0.400" DIP

File Size 459.43K  /  1 Page

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Amphenol Communications Solutions

Part No. 86840-450HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 50 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 5.84 mm (0.23in) Tail.
Tech specs    

Official Product Page

    104505-4

Tyco Electronics
Part No. 104505-4
Description PIN CONTACT, AMPMODU, MTE

File Size 92.17K  /  1 Page

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Amphenol Communications Solutions

Part No. 20021831-04508T1LF
Description Minitek127®, Board to Board Stacking Header , Surface Mount, Double Row, 08 positions, 1.27mm (0.500in) pitch.
Tech specs    

Official Product Page

    ERNI Electronics
Part No. 204504
Description TMC-S-37-THR OM-Euro-BA8

File Size 116.55K  /  1 Page

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Amphenol Communications Solutions

Part No. 54242-104500950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    ERNI ELECTRONICS INC
Part No. 104500
Description 15 CONTACT(S), FEMALE, D SUBMINIATURE CONNECTOR, SOLDER

File Size 314.06K  /  4 Page

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Amphenol Communications Solutions

Part No. 67045-018LF
Description Quickie®, Wire To Board, Strain Relief, 18 Positions
Tech specs    

Official Product Page

    2-104503-0 2-104503-2 2-104503-4 2-104503-1 2-104503-3

Tyco Electronics
Part No. 2-104503-0 2-104503-2 2-104503-4 2-104503-1 2-104503-3
Description PIN HOUSING, AMPMODU MTE, SINGLE ROW, .100 C/L, ITH GUIDE RIBS
PIN HOUSING, AMPMODU MTE, SINGLE ROW, .100 C/L, WITH GUIDE RIBS

File Size 62.09K  /  1 Page

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Amphenol Communications Solutions

Part No. 71600-450LF
Description Quickie IDC Receptacle, Wire to Board connector -Double row - 50Positions - 2.54 mm (0.100in) Pitch
Tech specs    

Official Product Page

    ATS-50450B-C2-R0

Advanced Thermal Solutions, Inc.
Part No. ATS-50450B-C2-R0
Description Ultra High Performance BGA Cooling

File Size 266.98K  /  1 Page

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Amphenol Communications Solutions

Part No. 67045-016LF
Description Quickie®, Wire To Board, Strain Relief, 16 Positions
Tech specs    

Official Product Page

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