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Amphenol Communications Solutions |
| Part No. |
10127820-0222LLF
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| Description |
Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, 80u\\ Min Tin plating, Natural Color, 2 Positions, LCP, GW Compatible, Tray Packing.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68002-225HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 25 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68002-223HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 23 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68002-222HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 22 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10127820-0222LPLF
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| Description |
Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, 80u\\ Min Tin plating, Natural Color, 2 Positions, LCP, GW Compatible, Tray Packing, With Pegs.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68002-224HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 24 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0022269131 22-26-9131
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| Description |
2.54mm (.100) KK庐 IDT Double Cantilever Contact, 13 Circuits, Tin (Sn), Feed-To, 26 Stranded or Solid, and 28 Solid, Stranded, or Fused, Brown ID Strip
2.54mm (.100) KK? IDT Double Cantilever Contact, 13 Circuits, Tin (Sn), Feed-To, 26 Stranded or Solid, and 28 Solid, Stranded, or Fused, Brown ID Strip
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| File Size |
484.66K /
20 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
68002-220HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 20 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68002-227HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 27 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0022269162 22-26-9162
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| Description |
2.54mm (.100) KK庐 IDT Double Cantilever Contact, 16 Circuits, Tin (Sn), Feed-To, 24 Stranded, Solid, Fused, Topcoat, and 26 Fused and Topcoat, Green ID Strip
2.54mm (.100) KK? IDT Double Cantilever Contact, 16 Circuits, Tin (Sn), Feed-To, 24 Stranded, Solid, Fused, Topcoat, and 26 Fused and Topcoat, Green ID Strip
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| File Size |
484.67K /
20 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10127820-0222GPLF
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| Description |
Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, 80u\\ Min Tin plating, Natural Color, 2 Positions, GW Compatible Nylon66, Tray Packing, With Pegs.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10127820-0222LF
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| Description |
Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, 80u\\ Min Tin plating, Natural Color, 2 Positions, Non GW Compatible Nylon66, Tray Packing.
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| Tech specs |
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Official Product Page
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Price and Availability
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