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HSMC[Hi-Sincerity Mocroelectronics]
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| Part No. |
H50N03J
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| OCR Text |
...aterial: * Lead solder plating: sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
DIM A C F G H L M N a1 a2 a5
Min. 6.35 4.80 1.30 5.40 2.20 0.40 2.... |
| Description |
N-Channel Enhancement-Mode MOSFET (25V, 50A)
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| File Size |
60.31K /
5 Page |
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it Online |
Download Datasheet
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Hi-Sincerity Mocroelect...
HSMC[Hi-Sincerity Mocroelectronics]
Hi-Sincerity Mocroelectronics Corp.
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| Part No. |
H03N60 H03N60F H03N60E
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| OCR Text |
...aterial: * Lead solder plating: sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
DIM A B C D E F G H I J K L M N O P
Min. 5.58 8.38 4.40 1.15 0.35 ... |
| Description |
N-Channel Power Field Effect Transistor
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| File Size |
55.68K /
5 Page |
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it Online |
Download Datasheet |
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Hi-Sincerity Mocroelectronics Corp.
HSMC[Hi-Sincerity Mocroelectronics]
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| Part No. |
H04N60F H04N60E H04N60
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| OCR Text |
...aterial: * Lead solder plating: sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
DIM A B C D E F G H I J K L M N O P
Min. 5.58 8.38 4.40 1.15 0.35 ... |
| Description |
N-Channel Power Field Effect Transistor
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| File Size |
56.98K /
5 Page |
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it Online |
Download Datasheet |
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HSMC[Hi-Sincerity Mocroelectronics]
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| Part No. |
H05N50 H05N50F H05N50E
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| OCR Text |
...aterial: * Lead solder plating: sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
DIM A B C D E F G H I J K L M N O P
Min. 5.58 8.38 4.40 1.15 0.35 ... |
| Description |
N-CHANNEL POWER MOSFET
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| File Size |
44.53K /
4 Page |
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it Online |
Download Datasheet |
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Hi-Sincerity Mocroelectronics Corp.
HSMC[Hi-Sincerity Mocroelectronics]
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| Part No. |
H05N60 H05N60F H05N60E
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| OCR Text |
...aterial: * Lead solder plating: sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
DIM A B C D E F G H I J K L M N O P
Min. 5.58 8.38 4.40 1.15 0.35 ... |
| Description |
N-Channel Power Field Effect Transistor
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| File Size |
56.89K /
5 Page |
View
it Online |
Download Datasheet |
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State of the Art, Inc.
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| Part No. |
S1505CPX1R43F30 S1505CPX2R43F30
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| OCR Text |
...% m: 20% termination finish: x: sn60 over nickel (solderable) c: silver bearing (epoxy bondable-rohs) g: gold (epoxy bondable-rohs) y: silver over nickel (solderable -rohs) z: gold over nickel (solderable-rohs) termination finish: x: sn60 o... |
| Description |
RESISTOR, METAL GLAZE/THICK FILM, 0.33 W, 1 %, 300 ppm, 1.43 ohm, SURFACE MOUNT, 1505 CHIP
RESISTOR, METAL GLAZE/THICK FILM, 0.33 W, 1 %, 300 ppm, 2.43 ohm, SURFACE MOUNT, 1505 CHIP
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| File Size |
120.50K /
1 Page |
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it Online |
Download Datasheet |
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HSMC[Hi-Sincerity Mocroelectronics]
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| Part No. |
H35N03J
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| OCR Text |
...aterial: * Lead solder plating: sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
DIM A C F G H L M N a1 a2 a5
Min. 6.35 4.80 1.30 5.40 2.20 0.40 2.... |
| Description |
N-Channel Enhancement-Mode MOSFET (25V, 35A)
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| File Size |
85.16K /
5 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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