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    B32926E3106K000 B32926E3156K000 B32926F3206K000 B32928E3256K000 B32928E3306K000 B32928E3406K000 B32924E3475M000 B32926E3

EPCOS
Part No. B32926E3106K000 B32926E3156K000 B32926F3206K000 B32928E3256K000 B32928E3306K000 B32928E3406K000 B32924E3475M000 B32926E3475M000 B32924E3475M189 B32926E3475M189 B32924F3565K000 B32928E3256K189 B32928E3256M000 B32928E3256M189 B32928E3306K189 B32928E3306M000 B32928E3306M189 B32928E3406K189 B32928E3406M000 B32928E3406M189 B32928E3456M000 B32928E3456M189 B32924F3685K000 B32926E3685K000 B32924F3685K189 B32926E3685K189 B32924E3565M000 B32924E3565M189 B32924E3825M000 B32926F3206K189 B32926E3156K189 B32926E3156M000 B32924E3825M189 B32926E3106K189 B32924E3225M000 B32924E3225M189 B32924E3335M189 B32924E3685M000 B32924E3685M189 B32924E3335M000 B32923E3225M000 B32926E3225M000 B32924F3475K000 B32923E3225M189 B32926E3225M189 B32926E3206M000 B32926E3206M189 B32926E3156M189 B32924F3225K000 B32924F3225K189 B32926E3106M000 B32926E3106M189
OCR Text ...ltering - X2 / 305 V AC 3 embedding of capacitors in finished assemblies In many applications, finished circuit assemblies are embedded in plastic resins. In this case, both chemical and thermal influences of the embedding ("pottin...
Description Film Capacitors EMI Suppression Capacitors (MKP)

File Size 309.89K  /  17 Page

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    B32924C3105K783 B32924C3105K784 B32924C3105K786 B32924C3105K787 B32924C3105K788 B32924C3105K789 B32922C3104K783 B32922C3

EPCOS
Part No. B32924C3105K783 B32924C3105K784 B32924C3105K786 B32924C3105K787 B32924C3105K788 B32924C3105K789 B32922C3104K783 B32922C3154K783 B32922C3224K783 B32922D3334K783 B32922C3474K783 B32922C3564K783 B32923D3334K783 B32923C3474K783 B32923C3564K783 B32923C3684K783 B32923C3824K783 B32923C3105K783 B32924C3684K783 B32924C3824K783 B32924C3155K783 B32924C3225K783 B32922C3104K784 B32922C3154K784 B32922C3224K784 B32922D3334K784 B32922C3474K784 B32922C3564K784 B32923D3334K784 B32923C3474K784 B32923C3684K784 B32923C3684K786 B32923C3684K787 B32923C3684K788 B32923C3684K789 B32923C3684M783 B32923C3684M784 B32923C3684M786 B32923C3684M787 B32923C3684M788 B32923C3684M789 B32922C3104K786 B32922C3104K787 B32922C3104K788 B32922C3104K789 B32922C3104M783 B32922C3104M784 B32922C3104M786 B32922C3104M787 B32922C3104M788 B32922C3104M789 B32922C3154K786 B32922C3154K787 B32922C3154K788 B32922C3154K789 B32924C3105M783 B32924C3105M784 B32924C3105M786 B32924C3105M787 B32924C3105M788 B32924C3105M789 B32924C3155K784 B32924C3155K786 B32924C3155K787 B32924C3155K788 B32924C3155K789 B32923C3105K784 B32923C3105K788 B32923C3105K789 B32923C3105K787 B32923C3105K786 B32923C3564K784 B32922C3334M783 B32922C3334M784 B32922C3334M787
OCR Text ... B32924*7 X2 / 305 V AC 3 embedding of capacitors in finished assemblies In many applications, finished circuit assemblies are embedded in plastic resins. In this case, both chemical and thermal influences of the embedding ("pottin...
Description Film Capacitors EMI Suppression Capacitors (MKP)

File Size 307.07K  /  17 Page

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    M14128 D10 D22 ST1331 ST1336 ST14C02C C20 C30 D15 D20 M14256 M14C04 M14C16 M14C32 M14C64 M35101 M35102 ST1200 ST1305B ST

意法半导
STMICROELECTRONICS[STMicroelectronics]
Part No. M14128 D10 D22 ST1331 ST1336 ST14C02C C20 C30 D15 D20 M14256 M14C04 M14C16 M14C32 M14C64 M35101 M35102 ST1200 ST1305B ST1333 ST1335
OCR Text ...were developed specifically for embedding in Smartcards and Memory Cards The Micromodule provides: - Support for the chip - Electrical contacts - Suitable embedding interface for gluing the module to the plastic package potting side c...
Description Memory Card IC 256/128 Kbit Serial IC Bus EEPROM
Memory Micromodules General Information for D1/ D2 and C Packaging
Memory Micromodules General Information for D1, D2 and C Packaging
Memory Micromodules General Information for D1 D2 and C Packaging

File Size 276.09K  /  13 Page

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    LTC2161-14 LTC2162-14 LTC2160-14 LTC6400-14 LTC6431-15 LTC6403-1 LTC6400-20 LTC6400-26 LTC6400-8 LT6402-12 LT6402-20 LT6

Linear Technology
Part No. LTC2161-14 LTC2162-14 LTC2160-14 LTC6400-14 LTC6431-15 LTC6403-1 LTC6400-20 LTC6400-26 LTC6400-8 LT6402-12 LT6402-20 LT6402-6 LTC2158-14 LTC2156-14 LTC2157-14 LTC6430-15 LTC6420-20 LTC2216
OCR Text ...rom 50 sma to 50 sma without de-embedding (note 4). ltc6430-15 4 643015f the l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at t a = 25c, v cc = 5v, z source = z ...
Description High Linearity Differential RF/IF Amplifier/ADC Driver

File Size 1,693.74K  /  28 Page

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    PM8800 PM8800A

STMicroelectronics
Part No. PM8800 PM8800A
OCR Text ...mposed by the 802.3af standard, embedding a hot-swap MOSFET capable of sustaining twice the current of the 802.3af standard with a programmable DC current limit The integrated switching regulator of the PM8800 has been designed to work with...
Description Integrated IEEE 802.3af compliant PoE-PD interface and PWM controller with support of external source

File Size 191.90K  /  10 Page

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    MICROSEMI[Microsemi Corporation]
Part No. LX5506E-LQ LX5506E LX5506ELQ
OCR Text ...actual measured data without de-embedding. Test system EVM floor is 1.4~1.6% for input power levels in test. Typical ACPR vs. Pout (Vc=3.3V, Vref=2.9V, Icq=95mA, Freq=5.25GHz, 64QAM/54Mbps, 30MHz Offset) -45 -46 -47 -48 ACPR ACPR(dBc)...
Description Wireless LAN Power Amplifier
InGaP HBT 4 ?6GHz Power Amplifier
InGaP HBT 4 - 6GHz Power Amplifier
InGaP HBT 4 6GHz Power Amplifier

File Size 313.83K  /  7 Page

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