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Lite-On Technology Corp...
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Part No. |
LTL1BESTBKJH185P
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OCR Text |
...e lens to t he soldering point. dipping the lens into the solder must be avoided. do not apply any external stress to the lead frame during sol dering while the led is at high temperature. r ecomme... |
Description |
Through Hole Lamp
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File Size |
663.51K /
10 Page |
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it Online |
Download Datasheet
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Lite-On Technology Corp...
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Part No. |
LTL2R3KGP2
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OCR Text |
...e lens to t he soldering point. dipping the lens into the solder must be avoided . do not apply any external stress to the lead frame during sol dering while the led is at high temperature. r ecomm... |
Description |
Through Hole Lamp
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File Size |
573.59K /
10 Page |
View
it Online |
Download Datasheet
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Roithner LaserTechnik G...
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Part No. |
5RAA5111P
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OCR Text |
...th temperature 260 c max. dipping time 5 seconds max. dipping position no lower than 3 mm from the base of the epoxy bulb ? do not apply any stress to the lead particularly when heat. ? the leds must not be reposition aft... |
Description |
Visible LED 5 mm
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File Size |
105.11K /
3 Page |
View
it Online |
Download Datasheet
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Price and Availability
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