bumps pdf Datasheet P4 Full Text Search --- IC-ON-LINE


	Part Number	Hot Search : SD101 SP4414EU 7C135 STPM0111 APL1085 FN4724 FN4724 330PJ
	Product Description
	Full Text Search

bumps Datasheet PDF File

For bumps Found Datasheets File :: 2268 Search Time::1.719ms
Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

				STMICROELECTRONICS[STMicroelectronics]
Part No.	TS4973 TS4973IJT
OCR Text	...LE s FLIP CHIP PACKAGE 9 x 300m bumps DESCRIPTION At 3.3v, the TS4973 is an Audio Power Amplifier capable of delivering 400mW of continuous RMS ouput power into a 8 bridged-tied loads with 1% THD+N, and 30mW( typ ) per channel of continuou...
Description	1.2W TWO AUDIO INPUTS WITH GAIN CONTROL POWER AMPLIFIER WITH STANDBY MODE ACTIVE LOW
File Size	373.90K / 9 Page	View it Online	Download Datasheet

				STMicroelectronics
Part No.	TS4985 TS4985EIJT TS4985EIKJT
OCR Text	...r Zero Pop & Click Lead-free 15 bumps flip-chip package Pin Connections (top view) Flip-Chip 15 bumps Description The TS4985 has been designed for top of the class stereo audio applications. Thanks to its compact and power dissipa...
Description	2x1.2w Stereo Audio Power Amplifier with Dedicated Standby Pins
File Size	408.76K / 9 Page	View it Online	Download Datasheet

				ST Microelectronics STMICROELECTRONICS[STMicroelectronics]
Part No.	TS4990 TS4990IJT TS4990JT
OCR Text	...TY GAIN STABLE s AVAILABLE IN 9 bumps Flip Chip Package DESCRIPTION The TS4990 has been designed for demanding audio applications such as mobile phones and to minimize the number of external components. This Audio Power Amplifier is capabl...
Description	1W AUDIO POWER AMPLIFIER WITH ACTIVE LOW STANDBY MODE 1W AUDIO POWER AMPLIFIER WITH ACTIVE LOW STANDBY MODE
File Size	142.26K / 6 Page	View it Online	Download Datasheet

				NXP Semiconductors
Part No.	NTAG213 NT2H1311G0DUD NT2H1511G0DUD
OCR Text	...ccording to secs-ii format), au bumps, 144 bytes user memory, 50 pf input capacitance - nt2h1311g0dud ffc bump 8 inch wafer, 120 ? m thickness, on film frame carrier, electronic fail die marking according to secs-ii format), au bumps, 1...
Description	NFC Forum Type 2 Tag compliant IC with 144/504/888 bytes user memory
File Size	1,482.90K / 58 Page	View it Online	Download Datasheet

				California Micro Devices Corporation CALMIRCO[California Micro Devices Corp]
Part No.	CSPEMI307AG CSPEMI307A
OCR Text	...g (see note 2) BOTTOM VIEW (bumps Up View) (bumps Down View) 1 A B C 2 3 4 5 6 ESD_3 FILTER/ESD_2 FILTER/ESD_4 C1 C2 FILTER/ESD_1 C3 GND C4 FILTER/ESD_3 C5 GND C6 ESD_4 307A GND B1 A...
Description	4-Channel ESD/EMI Filter Array plus 4-Channel ESD Array for USB 4通道的ESD / EMI滤波器阵列加4通道的USB的ESD阵列 4 Channel EMI Filters with ESD Protection @ ±15kV plus 4 Channel ESD Protection Array @ ±15KV(IEC61000-4-2 Level 4 Contact ...
File Size	1,591.07K / 9 Page	View it Online	Download Datasheet

				California Micro Devices Corporation CALMIRCO[California Micro Devices Corp]
Part No.	CSPEMI306AG CSPEMI306A
OCR Text	.../ PINOUT DIAGRAMS TOP VIEW (bumps Down View) Orientation Marking (see note 2) BOTTOM VIEW (bumps Up View) 1 A B C 2 3 4 5 6 FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 C1 C2 GND C3 GND C4 B2 ...
Description	6 Channel EMI Filter Array with ESD Protection 6通道EMI滤波器与ESD保护阵列 6 Channel EMI Filter (30dB @ 900MHz) with ESD Protection @ ±15KV (IEC61000-4-2 Level 4 Contact Discharge), Chip Scale Package
File Size	2,069.19K / 10 Page	View it Online	Download Datasheet

				CALMIRCO[California Micro Devices Corp]
Part No.	CSPEMI205G CSPEMI205
OCR Text	... / PINOUT DIAGRAMS TOP VIEW (bumps Down View) Orientation Marking (se note 2) BOTTOM VIEW (bumps Up View) MIC_IN EAR2_IN EAR1_IN 12345 A B C CSPEMI205 A5 A3 GND GND A1 B2 A1 Orientation Marking AF B4 C5 C3 MIC_...
Description	3 Channel Headset EMI Filter with ESD Protection @ ±8kV (IEC61000-4-2 Level 4 Contact Discharge), Chip Scale Package
File Size	687.24K / 7 Page	View it Online	Download Datasheet

				Vishay Siliconix
Part No.	SI8902EDB-T2
OCR Text	...er wise specified): 1. 6 solder bumps are 95.5/3.8/0.7 sn/ag/cu. 2. backside surface is coated with a ag/ni/ti layer. 3. non-solder mask defined copper landing pad. 4. laser marks on the silicon die back. notes: a. use millimeters as the p...
Description	Trans MOSFET N-CH 20V 3.9A 6-Pin Micro Foot T/R
File Size	202.87K / 9 Page	View it Online	Download Datasheet

For bumps Found Datasheets File :: 2268 Search Time::1.719ms
Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |