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  90136-1118 Datasheet PDF File

For 90136-1118 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    90136-2118

Molex Electronics Ltd.
Part No. 90136-2118
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 18 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

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Amphenol Communications Solutions

Part No. 78290-136HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    90136-2315

Molex Electronics Ltd.
Part No. 90136-2315
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 15 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 254.34K  /  5 Page

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Amphenol Communications Solutions

Part No. 69190-136HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90136-2132

Molex Electronics Ltd.
Part No. 90136-2132
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 32 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 254.43K  /  5 Page

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Amphenol Communications Solutions

Part No. 68690-136HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    90136-1210

Molex Electronics Ltd.
Part No. 90136-1210
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 159.24K  /  4 Page

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Amphenol Communications Solutions

Part No. U77A11181001
Description SFP CAGE 1X1 TIN TRAY
Tech specs    

Official Product Page

    90136-2210

Molex Electronics Ltd.
Part No. 90136-2210
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Right Angle, Shrouded, 10 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 254.60K  /  5 Page

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Amphenol Communications Solutions

Part No. U77C11181011
Description BRIGHT TIN PLT/R EMI PIN
Tech specs    

Official Product Page

    90136-2318

Molex Electronics Ltd.
Part No. 90136-2318
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 254.34K  /  5 Page

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Amphenol Communications Solutions

Part No. 68491-118HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 18 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90136-2125

Molex Electronics Ltd.
Part No. 90136-2125
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 25 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 254.43K  /  5 Page

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Amphenol Communications Solutions

Part No. 77311-118-09LF
Description BergStik®, Board to Board connector, 2.54mm (0.100in), Unshrouded Vertical Header, Through Hole, Single Row, 9 Positions
Tech specs    

Official Product Page

    90136-1212

Molex Electronics Ltd.
Part No. 90136-1212
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 159.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 77311-118-19LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    90136-2112

Molex Electronics Ltd.
Part No. 90136-2112
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 12 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 254.43K  /  5 Page

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Amphenol Communications Solutions

Part No. 77311-118-29LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 29 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    90136-2110

Molex Electronics Ltd.
Part No. 90136-2110
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 10 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 254.53K  /  5 Page

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Amphenol Communications Solutions

Part No. 54111-118021450LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 2 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 90136-1118 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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