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  55487-0819 Datasheet PDF File

For 55487-0819 Found Datasheets File :: 79+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 |   

   
Part No. 74ALVC126_DS_80819
Description From old datasheet system

File Size 53.20K  /  6 Page

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Amphenol Communications Solutions

Part No. 54122-112081950RLF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Toshiba
Part No. 2SA1832F EE08197
Description AUDIO FREQUENCY GENERAL PURPOSE AMPLIFIER APPLICATIONS
From old datasheet system

File Size 132.56K  /  2 Page

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Amphenol Communications Solutions

Part No. 54242-812081900LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    55755-0819 0557550819

Molex Electronics Ltd.
Part No. 55755-0819 0557550819
Description 2.00mm (.079) Pitch Wire-to-Board Header, Vertical, Shrouded, Kinked PC Tail, with Inner Positive Lock, 8 Circuits, Lead-free

File Size 165.66K  /  5 Page

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Amphenol Communications Solutions

Part No. 57102-F08-19LF
Description Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 38 Positions - 2mm (0.079inch) - Vertical
Tech specs    

Official Product Page

    HN1L03FU EE08199

Toshiba Semiconductor
Part No. HN1L03FU EE08199
Description N/P CHANNEL MOS TYPE (HIGH SPEED SWITCHING/ ANALOG SWITCH APPLICATIONS)
From old datasheet system
N,P CHANNEL MOS TYPE (HIGH SPEED SWITCHING, ANALOG SWITCH APPLICATIONS)

File Size 306.21K  /  6 Page

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Amphenol Communications Solutions

Part No. 57102-S08-19LF
Description Minitek® 2.00mm, Board/Wire to Board Connector, 2.00mm (0,079in), Unshrouded Vertical Header, Through Hole, Double Row, 38 Positions
Tech specs    

Official Product Page

    0009508193

Molex Electronics Ltd.
Part No. 0009508193
Description 3.96mm (.156) Pitch KK? Crimp Terminal Housing, Friction Ramp, 19 Circuits

File Size 400.92K  /  4 Page

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Amphenol Communications Solutions

Part No. 54202-T0819LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 38 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    52808-1970 0528081970

Molex Electronics Ltd.
http://
Part No. 52808-1970 0528081970
Description 1.00mm (.039) Pitch FFC/FPC Connector, SMT, Vertical, Non-ZIF Receptacle, 19Circuits, Lead-free

File Size 553.08K  /  10 Page

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Amphenol Communications Solutions

Part No. 57102-G08-19LF
Description Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 38 Positions - 2mm (0.079inch) - Vertical
Tech specs    

Official Product Page

    0009508191

Molex Electronics Ltd.
Part No. 0009508191
Description 3.96mm (.156) Pitch KK? Crimp Terminal Housing, Friction Ramp, 19 Circuits

File Size 286.34K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-809081900LF
Description BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Through Hole, Double Row, 8 Positions
Tech specs    

Official Product Page

    0520890819 52089-0819

Molex Electronics Ltd.
Part No. 0520890819 52089-0819
Description 1.00mm (.039) Pitch FFC/FPC Connector, Through-Hole, Right Angle, Low ProfileZIF, Top Contact Style Receptacle, 8 Circuits, Lead-free
MOLEX Connector

File Size 123.21K  /  3 Page

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Amphenol Communications Solutions

Part No. 54122-112081950LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    43650-0819 0436500819

Molex Electronics Ltd.
Part No. 43650-0819 0436500819
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Vertical, with Press-fit

File Size 169.25K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-811081900LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    43045-0819 0430450819

Molex Electronics Ltd.
Part No. 43045-0819 0430450819
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Solder Tab, 8 Circuits

File Size 174.46K  /  3 Page

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Amphenol Communications Solutions

Part No. 54121-112081950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 55487-0819 Found Datasheets File :: 79+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 |   

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