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  44769-1401 Datasheet PDF File

For 44769-1401 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    0447692201 44769-2201

Molex Electronics Ltd.
Part No. 0447692201 44769-2201
Description 3.00mm (.118") Pitch Micro-Fit 3.0, BMI Receptacle Header, Dual Row, Vertical, with Press-fit Plastic
3.00mm (.118) Pitch Micro-Fit 3.0, BMI Receptacle Header, Dual Row, Vertical, with Press-fit Plastic

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Amphenol Communications Solutions

Part No. 77311-401-00LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 00 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0447692202 44769-2202

Molex Electronics Ltd.
Part No. 0447692202 44769-2202
Description 3.00mm (.118) Pitch Micro-Fit 3.0, BMI?/a> Receptacle Header, Dual Row, Vertical, with Press-fit Plastic Pegs, 0.38μm (15μ) Gold (Au) Selective, 22 Circuits
3.00mm (.118) Pitch Micro-Fit 3.0, BMI Receptacle Header, Dual Row, Vertical, with Press-fit Plastic Pegs, 0.38μm (15μ) Gold (Au) Selective, 22 Circuits

File Size 141.65K  /  3 Page

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Amphenol Communications Solutions

Part No. 88914-016LF
Description Metral® Accessories, Backplane Connectors, Board-to-Board Keying System Keying Pin, LF.
Tech specs    

Official Product Page

    44769-1803 0447691803

Molex Electronics Ltd.
Part No. 44769-1803 0447691803
Description 3.00mm (.118) Pitch Micro-Fit 3.0, BMI?/a> Receptacle Header, Dual Row, Vertical, with Press-fit Plastic Pegs, 0.8μm (30μ) Gold (Au) Selective, 18 Circuits
3.00mm (.118) Pitch Micro-Fit 3.0, BMI Receptacle Header, Dual Row, Vertical, with Press-fit Plastic Pegs, 0.8μm (30μ) Gold (Au) Selective, 18 Circuits

File Size 141.64K  /  3 Page

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Amphenol Communications Solutions

Part No. 54122-811401800LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 40 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    44769-1802 0447691802

Molex Electronics Ltd.
Part No. 44769-1802 0447691802
Description 3.00mm (.118) Pitch Micro-Fit 3.0, BMI?/a> Receptacle Header, Dual Row, Vertical, with Press-fit Plastic Pegs, 0.38μm (15μ) Gold (Au) Selective, 18 Circuits
3.00mm (.118) Pitch Micro-Fit 3.0, BMI Receptacle Header, Dual Row, Vertical, with Press-fit Plastic Pegs, 0.38μm (15μ) Gold (Au) Selective, 18 Circuits

File Size 141.65K  /  3 Page

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Amphenol Communications Solutions

Part No. 10140155-002LF
Description HPCE VT Receptacle 2LP12S
Tech specs    

Official Product Page

    0447692203 44769-2203

Molex Electronics Ltd.
Part No. 0447692203 44769-2203
Description 3.00mm (.118) Pitch Micro-Fit 3.0, BMI?/a> Receptacle Header, Dual Row, Vertical, with Press-fit Plastic Pegs, 0.8μm (30μ) Gold (Au) Selective, 22 Circuits
3.00mm (.118) Pitch Micro-Fit 3.0, BMI Receptacle Header, Dual Row, Vertical, with Press-fit Plastic Pegs, 0.8μm (30μ) Gold (Au) Selective, 22 Circuits

File Size 141.64K  /  3 Page

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Amphenol Communications Solutions

Part No. 77311-401-03LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 03 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    SD-44769-001 44769-1801 0447691801

Molex Electronics Ltd.
Part No. SD-44769-001 44769-1801 0447691801
Description 3.00mm (.118) Pitch Micro-Fit 3.0, BMI Receptacle Header, Dual Row, Vertical, with Press-fit Plastic Pegs, 2.54um

File Size 141.63K  /  3 Page

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Amphenol Communications Solutions

Part No. 77311-401-15LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 15 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    1401

Vishay Siliconix
Vishay Intertechnology,Inc.
Part No. 1401
Description Bulk Metal Foil Technology, 3 Pin Transistor Outline Hermetic Resistor Network
Bulk Metal?? Foil Technology 3 Pin Transistor Outline Hermetic Resistor Network
SPACER NYLON .028X.060

File Size 44.86K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-401-26LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 26 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    VISAY[Vishay Siliconix]
Part No. 1401
Description Bulk Metal Foil Technology 3 Pin Transistor Outline Hermetic Resistor Network

File Size 38.77K  /  1 Page

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Amphenol Communications Solutions

Part No. 10140125-640110LF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Straddle-Mount, x4, 64 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    PMC-1401

PIC GmbH
Part No. PMC-1401
Description Standard Reed Switch

File Size 20.54K  /  1 Page

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Amphenol Communications Solutions

Part No. 54112-411401200LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Pulse A Technitrol Comp...
Part No. M1401
Description SMT FLYBACK TRANSFORMER

File Size 118.34K  /  2 Page

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Amphenol Communications Solutions

Part No. 10116951-4010LF
Description CXP Passive Copper Cable Assemblies, Passive, 10Gb/s, 26 AWG, 1.0m, non-halogen free
Tech specs    

Official Product Page

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