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  44067-0802 Datasheet PDF File

For 44067-0802 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    44067-1201 0440671201

Molex Electronics Ltd.
Part No. 44067-1201 0440671201
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 12 Circuits, Tin (Sn) Plating
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 12 Circuits, Tin (Sn) Plating

File Size 204.11K  /  3 Page

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Texas Instruments

Part No. 5962R0720802VXC
Description 12-Bit, 500-MSPS Analog-to-Digital Converter - Class V 84-CFP -55 to 125
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    44067-0201 0440670201

Molex Electronics Ltd.
Part No. 44067-0201 0440670201
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")

File Size 204.09K  /  3 Page

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Texas Instruments

Part No. V62/14608-02YE
Description Mixed Signal Microcontroller, MSP430F5438A-EP 100-LQFP -55 to 125
Tech specs    

Get Free Sample

Official Product Page

    44067-0401 0440670401

Molex Electronics Ltd.
Part No. 44067-0401 0440670401
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB

File Size 204.10K  /  3 Page

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Texas Instruments

Part No. V62/05608-02YE
Description Enhanced Product Wideband Low-Distortion Fully Differential Amplifier 8-MSOP-PowerPAD -55 to 125
Tech specs    

Official Product Page

    0440671003 44067-1003

Molex Electronics Ltd.
Part No. 0440671003 44067-1003
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
MOLEX Connector

File Size 204.16K  /  3 Page

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Texas Instruments

Part No. TPS70802PWPG4
Description Dual-Output, 125-mA/250-mA Low Dropout Voltage Regulators with Integrated SVS 20-HTSSOP -40 to 125
Tech specs    

Get Free Sample

Official Product Page

    0440671001 44067-1001

Molex Electronics Ltd.
Part No. 0440671001 44067-1001
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
MOLEX Connector

File Size 204.09K  /  3 Page

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Texas Instruments

Part No. DAC0802LCMX
Description 8-Bit D/A Converter 16-SOIC 0 to 70
Tech specs    

Official Product Page

    44067-0402 0440670402

Molex Electronics Ltd.
Part No. 44067-0402 0440670402
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB

File Size 204.16K  /  3 Page

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Texas Instruments

Part No. TPS70802PWP
Description Dual-Output, 125-mA/250-mA Low Dropout Voltage Regulators with Integrated SVS 20-HTSSOP -40 to 125
Tech specs    

Get Free Sample

Official Product Page

    0440671403 44067-1403

Molex Electronics Ltd.
Part No. 0440671403 44067-1403
Description 3.00mm (.118) Pitch Micro-Fit 3.0?/a> Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 14 Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selecti
MOLEX Connector

File Size 204.16K  /  3 Page

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Texas Instruments

Part No. DAC0802LCMX/NOPB
Description 8-Bit D/A Converter 16-SOIC 0 to 70
Tech specs    

Get Free Sample

Official Product Page

    44067-0601 0440670601

Molex Electronics Ltd.
Part No. 44067-0601 0440670601
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 6 Circuits, Tin (Sn) Plating
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 6 Circuits, Tin (Sn) Plating

File Size 204.10K  /  3 Page

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Texas Instruments

Part No. ADC0802LCWM/NOPB
Description 8-Bit &#181;P Compatible A/D Converters 20-SOIC 0 to 70
Tech specs    

Get Free Sample

Official Product Page

    0440672201 44067-2201

Molex Electronics Ltd.
Part No. 0440672201 44067-2201
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
MOLEX Connector

File Size 204.11K  /  3 Page

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    44067-0603 0440670603

Molex Electronics Ltd.
Part No. 44067-0603 0440670603
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")

File Size 204.16K  /  3 Page

View it Online

Download Datasheet

For 44067-0802 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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