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  wedge Datasheet PDF File

For wedge Found Datasheets File :: 956    Search Time::1.312ms    
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    MACOM[Tyco Electronics]
Part No. MAAPGM0053-DIE
OCR Text ...ard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable. Biasing Note: Must apply ne...
Description Amplifier, Distributed Power, 0.5 W 2.0-18.0 GHz

File Size 336.22K  /  5 Page

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    MACOM[Tyco Electronics]
Part No. MAAPGM0052-DIE
OCR Text ...ard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable. Biasing Note: Must apply ne...
Description Amplifier, Distributed Power 4.0-18.0 GHz

File Size 331.53K  /  6 Page

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    MACOM[Tyco Electronics]
Part No. MAAPGM0044-DIE
OCR Text ...ard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable. Biasing Note: Must apply ne...
Description Amplifier, Power, 0.5W 11.5-16.5 GHz

File Size 252.14K  /  5 Page

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    776164-1 776164-2 776164-4 776164-5 776164-6

Tyco Electronics
Part No. 776164-1 776164-2 776164-4 776164-5 776164-6
OCR Text ... 22 part number housing locking wedge mating seal wire seal cover 776164-1 pbt, black pbt, red silicone rubber, red silicone rubber, red glass filled pbt, black 776164-2 pbt, natural 776164-4 pbt, gray 776164-5 pbt, blue 776164-6 pbt, orang...
Description PLUG ASSEMBLY, 35 POSITION, AMPSEAL

File Size 156.09K  /  1 Page

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    MACOM[Tyco Electronics]
Part No. MAAPGM0042-DIE
OCR Text ...ard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable. Biasing Note: Must apply ne...
Description 1.2W X/Ku-Band Power Amplifier 11.5-16.0 GHz

File Size 420.43K  /  6 Page

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    MACOM[Tyco Electronics]
Part No. MAAPGM0041-DIE
OCR Text ...ard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable. Biasing Note: Must apply ne...
Description 1.3W X/Ku-Band Power Amplifier 11.0-15.0 GHz

File Size 253.62K  /  6 Page

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    MACOM[Tyco Electronics]
Part No. MAAPGM0038-DIE
OCR Text ...ard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable. Biasing Note: Must apply ne...
Description 1.2W C/Ku-Band Power Amplifier 7.5-13.5 GHz

File Size 334.38K  /  6 Page

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    MACOM[Tyco Electronics]
Part No. MAAPGM0037-DIE
OCR Text ...ard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable. Biasing Note: Must apply...
Description Amplifier, Power, 1.0W 6.5-12.5 GHz

File Size 185.25K  /  5 Page

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    MACOM[Tyco Electronics]
Part No. MAAPGM0036-DIE
OCR Text ...ard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable. Biasing Note: Must apply ne...
Description 1.2-3.2 GHz 1.2W Power Amplifier

File Size 247.95K  /  6 Page

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    MACOM[Tyco Electronics]
Part No. MAAPGM0034-DIE
OCR Text ...ard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable. Biasing Note: Must apply ne...
Description 0.5W X/Ku-Band Power Amplifier 8.0-12.5 GHz

File Size 268.13K  /  6 Page

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For wedge Found Datasheets File :: 956    Search Time::1.312ms    
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