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thickness. Datasheet PDF File

For thickness. Found Datasheets File :: 42040 Search Time::1.328ms
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				MICROSEMI CORP-LAWRENCE CDI-DIODE[Compensated Deuices Incorporated] Compensated Devices Incorporated
Part No.	CD5356B CD5364B CD5349B CD5339B CD5345B CD5360B CD5361B CD5362B CD5363B CD5365B CD5366B CD5367B CD5368B CD5369B CD5370B CD5371B CD5372B CD5373B CD5374B CD5375B CD5376B CD5377B CD5378B CD5379B CD5333B CD5334B CD5335B CD5336B CD5337B CD5338B CD5340B CD5341B CD5342B CD5343B CD5344B CD5346B CD5347B CD5348B CD5350B CD5351B CD5352B CD5353B CD5354B CD5355B CD5357B CD5358B CD5359B CD5334 CD5339A D5337A CD5350A CD5350 CD5370 CD5333
OCR Text	...k: (Cathode).......... ...Au AL thickness....... ....25,000 A Min GOLD thickness........4,000 A Min CHIP thickness............. .....10 Mils CIRCUIT LAYOUT DATA: For Zener operation, cathode must be operated positive with respect to anode. ...
Description	surface mount silicon Zener diodes 4.7 V, 5 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE 5.6 V, 5 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE 3.6 V, 5 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE ZENER DIODE CHIPS 13 V, 5 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE 56 V, 5 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE 3.3 V, 5 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE
File Size	81.71K / 2 Page	View it Online	Download Datasheet

				Hi-Sincerity Microelectronics HSMC[Hi-Sincerity Mocroelectronics]
Part No.	HA8050 HA8050S
OCR Text	...on: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your loc...
Description	NPN EPITAXIAL PLANAR TRANSISTOR
File Size	35.62K / 4 Page	View it Online	Download Datasheet

				Hi-Sincerity Microelectronics HSMC[Hi-Sincerity Mocroelectronics] Hi-Sincerity Mocroelect...
Part No.	HBAT54C HBAT54S HBAT54A HBAT54
OCR Text	...on: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your loc...
Description	Silicon Schottky Barrier Double Diodes
File Size	22.64K / 3 Page	View it Online	Download Datasheet


Part No.	V23990-P586-A
OCR Text	...pro chip r thjh thermal grease thickness 50um 1,8 k/w thermal resistance chip to case per chip w?rmewiderstand chip-gehause pro chip r thjc warmeleitpaste dicke 50um = 0,61 w/mk 1,2 k/w transistor inverte r transistor wechselri...
Description	30 A, 600 V, N-CHANNEL IGBT
File Size	101.39K / 5 Page	View it Online	Download Datasheet

				Intersil, Corp. Intersil Corporation
Part No.	5962F9863401V9A 5962F9863401VCC 5962F9863401VXC ACS174DMSR-03 ACS174KMSR-03 ACS174HMSR-03 ACS174K ACS174MS
OCR Text	...90m x 2390m (94 mils x 94 mils) Thickness: 525m 25m (20.6 mils 1 mil) Bond Pad: 110m x 110m (4.3 x 4.3 mils) METALLIZATION: AI Metal 1 Thickness: 0.7m 0.1m Metal 2 Thickness: 1.0m 0.1m SUBSTRATE POTENTIAL Unbiased Insulator PASSIVATION: Typ...
Description	Radiation Hardened Hex D-Type Flip-Flop with Reset 辐射硬化六角D类触发器触发器的复位 RES 46.4K OHM MTL FILM .60W 1% T AC SERIES, HEX POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CDFP16 Radiation Hardened Hex D-Type Flip-Flop with Reset AC SERIES, HEX POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CDIP16
File Size	38.33K / 2 Page	View it Online	Download Datasheet

				Cree, Inc
Part No.	CXXXXB900-SX000-A C527XB900-S4000-A C470XB900-S9000-A C460XB900-S9000-A C505XB900-S6000-A
OCR Text	...p Area (m) Bottom Area (m) Chip Thickness (m) Top Au Bond Pad Diameter (m) Au Bond Pad Thickness (m) Back Contact Metal Area (m) Back Contact Metal Thickness (m) 3.0 3.0 3.0 3.0 Typ. 3.4 3.4 3.4 3.4 Max. 3.9 3.9 3.9 3.9 Note CxxxXB900-...
Description	XBright? Power Chip LED
File Size	231.55K / 4 Page	View it Online	Download Datasheet

				HITACHI[Hitachi Semiconductor]
Part No.	HD74LV00A
OCR Text	...Dimension including the plating thickness Base material dimension 10 0.10 0.10 0.15 HD74LV00A Unit: mm 8.65 9.05 Max 14 8 3.95 1 1.75 Max 7 *0.22 0.03 0.20 0.03 0.10 6.10 + 0.30 - 0.635 Max 1.08 0 - 8 0.11 0.1...
Description	Quad. 2-input NAND Gates
File Size	50.42K / 13 Page	View it Online	Download Datasheet

				Hi-Sincerity Microelectronics HSMC[Hi-Sincerity Mocroelectronics] Hi-Sincerity Mocroelectroni...
Part No.	HE8050S
OCR Text	...n : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your loc...
Description	NPN EPITAXIAL PLANAR TRANSISTOR
File Size	37.94K / 4 Page	View it Online	Download Datasheet

				Hi-Sincerity Microelectronics HSMC[Hi-Sincerity Mocroelectronics]
Part No.	HE8050
OCR Text	...n : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your loc...
Description	NPN EPITAXIAL PLANAR TRANSISTOR
File Size	35.35K / 3 Page	View it Online	Download Datasheet

For thickness. Found Datasheets File :: 42040 Search Time::1.328ms
Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |