| |
|
 |
MACOM[Tyco Electronics]
|
| Part No. |
MA4SPS422 MA4SPS42 MA4SPS420
|
| OCR Text |
...ce No Wirebonds Required Rugged silicon-glass Construction silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance Higher Average and Peak Power Handling
MA4SPS420 Series V2
Absolute Maximum Ratin... |
| Description |
SURMOUNT PIN Diodes
|
| File Size |
206.90K /
7 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
MACOM[Tyco Electronics]
|
| Part No. |
MA4SPS502_1 MA4SPS5021
|
| OCR Text |
silicon-glass Construction silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance High Power Handling (Efficient Heatsinking)
MA4SPS502 V1
Absolute Maximum Ratings1 @ TA = +25 C (unless otherwise... |
| Description |
SURMOUNT PIN Diode
|
| File Size |
140.90K /
4 Page |
View
it Online |
Download Datasheet |
| |
|
|
MACOM[Tyco Electronics]
|
| Part No. |
MA4SPS502
|
| OCR Text |
...ce No Wirebonds Required Rugged silicon-glass Construction silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance High Power Handling (Efficient Heatsinking)
Description
This device is a silicon-... |
| Description |
Surface Mount Monolithic PIN Diode Chip
|
| File Size |
125.84K /
3 Page |
View
it Online |
Download Datasheet |
| |
|
|
MACOM[Tyco Electronics]
|
| Part No. |
MA4SPS552-W MA4SPS552 MA4SPS552-T
|
| OCR Text |
...ce No Wirebonds Required Rugged silicon-glass Construction silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance High Power Handling (Efficient Heatsinking)
B
Description
This device is a sil... |
| Description |
Surface Mount Monolithic PIN Diode Chip
|
| File Size |
151.58K /
6 Page |
View
it Online |
Download Datasheet |
| |
|
|
M/A-COM Technology Solu...
|
| Part No. |
MADP-000552-12810T
|
| OCR Text |
...wirebonds required ? rugged silicon - glass construction ? silicon nitride passivation ? polymer scratch protection ? ultra - low parasitic capacitance and inductance ? higher power handling (efficient heat sinking) ? ... |
| Description |
SURMOUNT PIN Diode
|
| File Size |
803.56K /
6 Page |
View
it Online |
Download Datasheet |
| |
|
|
TOSHIBA
|
| Part No. |
TPH14006NH
|
| OCR Text |
silicon n-channel mos (u-mos -h) tph14006nh tph14006nh tph14006nh tph14006nh start of commercial production 2011-11 1. 1. 1. 1. applica...glass-epoxy board (a), figure 5.1 note 4: device mounted on a glass-epoxy board (b), figure 5.2 note... |
| Description |
Power MOSFET (N-ch single 30V<VDSS≤60V)
|
| File Size |
235.45K /
9 Page |
View
it Online |
Download Datasheet |
| |
|
|
MACOM[Tyco Electronics]
|
| Part No. |
MADS-002545-1307MT MADS-002545-1307M MADS-002545-1307MG MADS-002545-1307MR
|
| OCR Text |
silicon Schottky Diodes: Cross-Over Quad Series Ultra-small 600x600um Surface-Mount Chip
Features
* Ultra Low Parasitic Capitance and Indu...glass dielectric, which acts as the low dispersion, low loss, microstrip transmission medium. The co... |
| Description |
SURMOUNTTM Medium Barrier silicon Schottky Diodes: Cross-Over Quad Series Ultra-small 600x600um Surface-Mount Chip
|
| File Size |
192.39K /
3 Page |
View
it Online |
Download Datasheet |
|
Price and Availability
|
