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Part No. |
LA38B-65-G
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OCR Text |
...ne the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead w...low temperature. the purpose of this test is the resistance of the device under tropical for hous.... |
Description |
LED ARRAY
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File Size |
95.36K /
5 Page |
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it Online |
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Infineon Technologies
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Part No. |
IPD60R600C6 IPP60R600C6 IPB60R600C6
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OCR Text |
...ondition min. typ. max. thermal resistance, junction - case r thjc -- 2.0c/w thermal resistance, junction - ambient r thja - - 62 leaded soldering temperature, wavesoldering only allowed at leads t sold - - 260 c 1.6 mm (0.063 in.) f... |
Description |
MOSFET Power Transistor
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File Size |
1,908.99K /
18 Page |
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it Online |
Download Datasheet
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Part No. |
LA38B-65-Y
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OCR Text |
...on the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device which is laid under ondition of hogh temperature for hours. ... |
Description |
LED ARRAY
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File Size |
95.40K /
5 Page |
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it Online |
Download Datasheet
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http://
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Part No. |
LA38B-66-G
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OCR Text |
...6/g
thermal shock test solder resistance test high temperature high humidity test solderability test mil-std-202:103b jis c 7021: b-1...low temperature. the purpose of this test is the resistance of the device under tropical for hous.... |
Description |
LED ARRAY
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File Size |
104.85K /
6 Page |
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it Online |
Download Datasheet
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