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  hmic Datasheet PDF File

For hmic Found Datasheets File :: 210    Search Time::1.39ms    
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    MACOM[Tyco Electronics]
Part No. EMD40-900L_1 EMD40-1800L EMD40-900LTR EMD40-900L1
OCR Text hmic Double Balanced Surface Mount Mixer 700 - 1400 MHz Features * * * * * * LO Power +3 dBm to +7 dBm Up to +1 dBm RF IC Process Low Profile Surface Mount Tape and reel packaging available EMD40-900L V1 SOIC -- 8 Package Descrip...
Description E-Series hmic Double Balanced Surface Mount Mixer 700 - 1400 MHz

File Size 87.62K  /  3 Page

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    MAMX-000900-1061LT

M/A-COM Technology Solutions, Inc.
Part No. MAMX-000900-1061LT
OCR Text hmic Mixer 700--1400 MHz Features * * * * * + 3 to + 7 dBm Fully Balanced Passive Mixer NO External Matching Required Low Cost Surface Mount Package RoHS* Compliant with 260 C Reflow Capability * 100% Matte Tin Plating Rev. V1 SOIC-8 P...
Description Silicon Double Balanced hmic Mixer 700-1400 MHz

File Size 97.97K  /  4 Page

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    MACOM[Tyco Electronics]
Part No. MA4BN1840-1
OCR Text hmic Integrated Bias Network 18 - 40 GHz V 1.00 MA4BN1840-1 Features n n n n n MA4BN1840-1 Chip Layout Broad Bandwidth Specified from 18 to 40 GHz Useable from 10 GHz to 50 GHz Extremely Low Insertion Loss High RF-DC Isolati...
Description Monolithic hmic Integrated Bias Network 18 - 40 GHz

File Size 178.30K  /  9 Page

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    MACOM[Tyco Electronics]
Part No. MA4BN1840-2
OCR Text hmic Integrated Dual Bias Network 18 - 40 GHz V 1.00 MA4BN1840-2 Features n n n n n MA4BN1840-2 Chip Layout Broad Bandwidth Specified for 18 to 40 GHz Useable from 15 GHz to 50 GHz Extremely Low Insertion Loss High RF-DC Iso...
Description Monolithic hmic Integrated Dual Bias Network 18 - 40 GHz

File Size 174.51K  /  8 Page

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    MACOM[Tyco Electronics]
Part No. MA4DP918-1277
OCR Text hmicTM Integrated Passive Diplexer GSM/DCS or AMPS/PCS Applications 3 mm square MLP Plastic Package V 1.00 MA4DP918-1277 Features n n n n n n n 3mm MLP Plastic Package hmic Integrated Passive Circuit Low Insertion Loss, High...
Description hmicTM Integrated Passive Diplexer GSM/DCS or AMPS/PCS Applications 3 mm square MLP Plastic Package

File Size 105.57K  /  3 Page

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    MACOM[Tyco Electronics]
Part No. MA4E2501L-1290W MA4E2501-1290 MA4E2501L-1290 MA4E2501L-1290T
OCR Text ... No Wirebonds Required * Rugged hmic Construction with Polyimide Scratch Protection * Reliable, Multilayer Metalization with a Diffusion Barrier, 100% Stabilization Bake (300 C, 16 hours) * Lower Susceptibility to ESD Damage MA4E2501-129...
Description SILICON, LOW BARRIER SCHOTTKY, KU BAND, MIXER DIODE
SURMOUNTTM Low Barrier 0201 Footprint Silicon Schottky Diodes

File Size 102.85K  /  3 Page

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    MACOM[Tyco Electronics]
Part No. MA4E2502M MA4E2502 MA4E2502H MA4E2502L
OCR Text ... No Wirebonds Required * Rugged hmic Construction with Polyimide Scratch Protection * Reliable, Multilayer Metalization with a Diffusion Barrier, 100% Stabilization Bake (300 C, 16 hours) * Lower Susceptibility to ESD Damage MA4E2502 Ser...
Description SURMOUNTTM Low, Medium and High Barrier Silicon Schottky Diodes

File Size 270.60K  /  4 Page

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    MACOM[Tyco Electronics]
Part No. MA4E2508M MA4E2508 MA4E2508H MA4E2508L
OCR Text ... No Wirebonds Required * Rugged hmic Construction with Polyimide Scratch Protection * Reliable, Multilayer Metalization with a Diffusion * Barrier, 100% Stabilization Bake (300C, 16 hours) * Lower Susceptibility to ESD Damage MA4E2508 Se...
Description SURMOUNTTM Low and Medium & High Barrier Silicon Schottky Diodes: Anti-Parallel Pair

File Size 98.58K  /  4 Page

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    MACOM[Tyco Electronics]
Part No. MA4E2513L-1289W MA4E2513 MA4E2513-1289 MA4E2513L-1289 MA4E2513L-1289T
OCR Text ... No Wirebonds Required * Rugged hmic Construction with Polyimide Scratch Protection * Reliable, Multilayer Metalization with a Diffusion * Barrier, 100% Stabilization Bake (300C, 16 hours) * Lower Susceptibility to ESD Damage MA4E2513-12...
Description SURMOUNT Low Barrier Tee ?301 Footprint Silicon Schottky Diodes
SURMOUNT Low Barrier Tee “0301” Footprint Silicon Schottky Diodes

File Size 87.11K  /  3 Page

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    MACOM[Tyco Electronics]
Part No. MA4E2514M-1116W MA4E2514 MA4E2514L MA4E2514L-1116 MA4E2514L-1116T MA4E2514L-1116W MA4E2514M MA4E2514M-1116
OCR Text ... No Wirebonds Required n Rugged hmic Construction with Polyimide Scratch Protection n Reliable, Multilayer Metalization with a Diffusion Barrier, 100% Stabilization Bake (300 C, 16 hours) n Lower Susceptibility to ESD Damage n n B De...
Description SURMOUNT Low and Medium Barrier Silicon Schottky Diodes: Tee Pair

File Size 100.31K  /  4 Page

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For hmic Found Datasheets File :: 210    Search Time::1.39ms    
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