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  HM61-20180 Datasheet PDF File

For HM61-20180 Found Datasheets File :: 113+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 |   

    MP201801 MP201802

List of Unclassifed Manufacturers
N.A.
ETC
Part No. MP201801 MP201802
Description MAGNETIC PROXIMITY SENSORS

File Size 202.31K  /  1 Page

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Amphenol Communications Solutions

Part No. 54122-114201800LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    LBT201803

SIPAT Co,Ltd
Part No. LBT201803
Description 2017.5MHz SAW Filter 15MHz Bandwidth

File Size 156.79K  /  3 Page

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Amphenol Communications Solutions

Part No. CE1201800110111
Description Cool Edge 0.80mm Hybrid Power and Signal Connectors, Storage and Server System, Through Hole/Surface mount, 2 power pins, 18 signal pins, Vertical
Tech specs    

Official Product Page

    Powerex Power Semicondu...
Part No. TA201800A
Description Phase Control Thyristor

File Size 1,550.69K  /  4 Page

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Amphenol Communications Solutions

Part No. 54121-809201800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    TA201800A

POWEREX[Powerex Power Semiconductors]
Part No. TA201800A
Description Phase Control SCR (1800 Amperes Average 2200 Volts)

File Size 473.06K  /  4 Page

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Amphenol Communications Solutions

Part No. 54121-109201800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    CHM61A3PAPT

Chenmko Enterprise Co. Ltd.
Part No. CHM61A3PAPT
Description N-Channel Enhancement Mode Field Effect Transistor

File Size 188.09K  /  2 Page

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Amphenol Communications Solutions

Part No. 54111-109201800LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    DG201808 DG2018DN

Vishay Siliconix
Part No. DG201808 DG2018DN
Description Low Voltage, Dual DPDT and Quad SPDT Analog Switches

File Size 135.29K  /  9 Page

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Amphenol Communications Solutions

Part No. 54112-109201800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    HM6167LP-6 HM6167H-55 HM6167P-8 HM6167P-6 HM6167LP-8 HM6167H-45 HM6167HLP-55 HM6167HP-45

Hitachi Semiconductor
Part No. HM6167LP-6 HM6167H-55 HM6167P-8 HM6167P-6 HM6167LP-8 HM6167H-45 HM6167HLP-55 HM6167HP-45
Description x1 SRAM x1的SRAM
16384 word x 1-Bit High Speed CMOS Static RAM

File Size 148.49K  /  7 Page

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Amphenol Communications Solutions

Part No. 10082201-803-03LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Pin In Paste, Single row , 3 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    HM6116 HM6116FP-2 HM6116FP-3 HM6116FP-4 HM6116LFP-2 HM6116LFP-3 HM6116LFP-4 HM6116LP-2 HM6116LP-3 HM6116LP-4 HM6116P-2 H

HITACHI[Hitachi Semiconductor]
Renesas Electronics Corporation
Part No. HM6116 HM6116FP-2 HM6116FP-3 HM6116FP-4 HM6116LFP-2 HM6116LFP-3 HM6116LFP-4 HM6116LP-2 HM6116LP-3 HM6116LP-4 HM6116P-2 HM6116P-3 HM6116P-4
Description 2048-word X 8bit High Speed CMOS Static RAM
IC,SRAM,2KX8,CMOS,DIP,24PIN,CERAMIC

File Size 250.27K  /  5 Page

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Amphenol Communications Solutions

Part No. 10140609-201802LF
Description Bergstak® 0.80mm Pitch, Board to Board Receptacle, Vertical, Double Row, 200 Positions, 0.80mm (0.031in) Pitch
Tech specs    

Official Product Page

    CY8C20180 CY8C20180-LDX2I CY8C20180-SX2I

Cypress Semiconductor
Part No. CY8C20180 CY8C20180-LDX2I CY8C20180-SX2I
Description CapSense Express?/a> -8 Configurable IOs
CapSense Express -8 Configurable IOs
CapSense Express⑩ -8 Configurable IOs

File Size 253.16K  /  12 Page

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Amphenol Communications Solutions

Part No. 54111-809201800LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0430201801 43020-1801

Molex Electronics Ltd.
Part No. 0430201801 43020-1801
Description 3.00mm (.118) Pitch Micro-Fit 3.0?/a> Plug Housing, Dual Row, without Panel Mount Ears, 18 Circuits
3.00mm (.118) Pitch Micro-Fit 3.0 Plug Housing, Dual Row, without Panel Mount Ears, 18 Circuits

File Size 208.00K  /  2 Page

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Amphenol Communications Solutions

Part No. 54122-814201800LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

For HM61-20180 Found Datasheets File :: 113+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 |   

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