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  chipscale Datasheet PDF File

For chipscale Found Datasheets File :: 155    Search Time::5.453ms    
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    Aeroflex, Inc.
Aeroflex Inc.
AEROFLEX[Aeroflex Circuit Technology]
Part No. ACT4438-1 ACT4438
OCR Text chipscale Package Preliminary Features * Transceiver meets military data bus requirements, MIL-STD-1553 and MIL-STD-1760 * Low power dissipation at full output power * Single +5V power supply * Current Source Transmitter Output * Bipol...
Description ACT4438-1 Transceiver for MIL-STD-1553 / 1760 in a chipscale Package ACT4438 - 1收发信机的MIL - STD -1760分之1553在芯片级封装
Transceiver for MIL-STD-1553 / MIL-STD-1760 in a chipscale Package

File Size 146.06K  /  7 Page

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    Maxim Integrated Produc...
MAXIM[Maxim Integrated Products]
Maxim Integrated Products, Inc.
Part No. MAX2240EVKIT MAX2240_1 MAX2240
OCR Text ...S-18R2JT MAX2240EBL 9-pin ultra-chipscale package (UCSP) Test points MAX2240 EV kit PC board, Rev B MAX2240 data sheet ________________________________________________________________ Maxim Integrated Products 1 For free samples an...
Description From old datasheet system
Evaluation Kit for the MAX2240

File Size 143.13K  /  6 Page

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    VISAY[Vishay Siliconix]
Part No. SI8411DB-T1 SI8411DB
OCR Text ... Power MOSFET D New MICRO FOOTr chipscale Packaging Reduces Footprint Area Profile (0.62 mm) and On-Resistance Per Footprint Area APPLICATIONS D D D D Load Switch Battery Switch Charger Switch PA Switch S MICRO FOOT Bump Side View ...
Description P-Channel 20-V (D-S) MOSFET

File Size 89.31K  /  6 Page

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    2DAC-C16R 2DAC-C16RLF

Bourns Electronic Solutions
Part No. 2DAC-C16R 2DAC-C16RLF
OCR Text ... V 6.5 V EXT8 Thinfilm Model chipscale No. of Solder Bumps Packaging Option R = Tape and Reel Packaged 3000 pcs. / 7 " reel Terminations LF = Sn/Ag/Cu (lead free) Blank = Sn/Pb EXT6 6.5 V GROUND 6.5 V EXT7 GROUND Fig. 4 - Dev...
Description Integrated Passive & Active Device using CSP

File Size 232.59K  /  4 Page

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    2DAD-C5RLF 2DAD-C5R

BOURNS[Bourns Electronic Solutions]
Part No. 2DAD-C5RLF 2DAD-C5R
OCR Text ...C5R ____ GND Thinfilm Model chipscale No. of Solder Bumps EXT4 EXT3 Packaging Option R = Tape and Reel Packaged 3000 pcs. / 7 " reel Terminations LF = Sn/Ag/Cu (lead free) Blank = Sn/Pb Specifications are subject to change withou...
Description Integrated Passive & Active Device using CSP

File Size 213.15K  /  4 Page

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    2FAD-C20R 2FAD-C20RLF

Bourns, Inc.
BOURNS[Bourns Electronic Solutions]
Part No. 2FAD-C20R 2FAD-C20RLF
OCR Text ...FAD - C20R ____ Thinfilm Model chipscale No. of Solder Bumps EXT7 EXT8 Packaging Option R = Tape and Reel Packaged 3000 pcs. / 7 " reel Terminations LF = Sn/Ag/Cu (lead free) Blank = Sn/Pb Fig. 4 - Device Block Diagram Speci...
Description Integrated Passive & Active Device using CSP

File Size 240.05K  /  4 Page

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    2FAE-C15R 2FAE-C15RLF

BOURNS[Bourns Electronic Solutions]
Bourns, Inc.
Part No. 2FAE-C15R 2FAE-C15RLF
OCR Text ...FAE - C15R ____ Thinfilm Model chipscale No. of Solder Bumps Packaging Option R = Tape and Reel Packaged 3000 pcs. / 7 " reel Terminations LF = Sn/Ag/Cu (lead free) Blank = Sn/Pb EXT2 R2: 100 ohms INT2 EXT3 R3: 100 ohms INT3...
Description Integrated Passive & Active Device using CSP

File Size 219.15K  /  4 Page

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    2FAG-C15RLF 2FAG-C15R

Bourns, Inc.
BOURNS[Bourns Electronic Solutions]
Part No. 2FAG-C15RLF 2FAG-C15R
OCR Text ...FAG - C15R ____ Thinfilm Model chipscale No. of Solder Bumps EXT2 R2: 100 ohms INT2 Packaging Option R = Tape and Reel Packaged 3000 pcs. / 7 " reel Terminations LF = Sn/Ag/Cu (lead free) Blank = Sn/Pb EXT3 R3: 100 ohms I...
Description Integrated Passive & Active Device using CSP

File Size 241.38K  /  4 Page

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    2FAK-C15R 2FAK-C15RLF

Bourns, Inc.
BOURNS[Bourns Electronic Solutions]
Part No. 2FAK-C15R 2FAK-C15RLF
OCR Text ...FAK - C15R ____ Thinfilm Model chipscale No. of Solder Bumps Packaging Option R = Tape and Reel Packaged 3000 pcs. / 7 " reel Terminations LF = Sn/Ag/Cu (lead free) Blank = Sn/Pb EXT2 R1: 100 ohms INT2 EXT3 R2: 100 ohms INT3...
Description Integrated Passive & Active Device using CSP

File Size 218.89K  /  4 Page

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    2FAM-C5RLF 2FAM-C5R

Bourns, Inc.
BOURNS[Bourns Electronic Solutions]
Part No. 2FAM-C5RLF 2FAM-C5R
OCR Text ...C5R ____ GND Thinfilm Model chipscale No. of Solder Bumps Packaging Option R = Tape and Reel Packaged 3000 pcs. / 7 " reel Terminations LF = Sn/Ag/Cu (lead free) Blank = Sn/Pb EXT2 INT2 R2: 10 OHMS Specifications are subject...
Description Integrated Passive & Active Device using CSP

File Size 235.85K  /  4 Page

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For chipscale Found Datasheets File :: 155    Search Time::5.453ms    
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