83230 pdf Datasheet P3 Part Num --- IC-ON-LINE


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83230 Datasheet PDF File

For 83230 Found Datasheets File :: 52+ Page :: | 1 | 2 | <3> | 4 | 5 | 6 |

					Toshiba
Part No.	TC83230-0006 E008072
Description	From old datasheet system
File Size	1,083.68K / 29 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	75168-323-04LF
Description	BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 04 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

HUA FENG CIRCUIT

					Molex Electronics Ltd.
Part No.	87832-3020 0878323020
Description	2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, Shrouded, Leadfree, 30 Circuits, 0.38μm (15μ) Gold (Au) Plating 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree, 30 Circuits, 0.38μm (15μ) Gold (Au) Plating
File Size	367.54K / 6 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	75168-323-08LF
Description	BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 08 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	87832-3022 0878323022
Description	2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, Shrouded, Leadfree 30 Circuits, 0.38μm (15μ) Gold (Au) Plating, Pick-and-Place Cap 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 30 Circuits, 0.38μm (15μ) Gold (Au) Plating, Pick-and-Place Cap
File Size	367.60K / 6 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68683-230LF
Description	Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Top Entry, 60 Positions, 2.54mm (0.100in) Pitch
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	87832-3023 0878323023
Description	2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, Shrouded, Leadfree 30 Circuits, 0.76μm (30μ) Gold (Au) Plating, Pick-and-Place Cap 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 30 Circuits, 0.76μm (30μ) Gold (Au) Plating, Pick-and-Place Cap
File Size	386.39K / 6 Page	View it Online	Download Datasheet

					Molex Electronics Ltd.
Part No.	87832-3021 0878323021
Description	2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, Shrouded, Leadfree 30 Circuits, 0.76μm (30μ) Gold (Au) Plating 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 30 Circuits, 0.76μm (30μ) Gold (Au) Plating
File Size	386.31K / 6 Page	View it Online	Download Datasheet

					Toshiba
Part No.	JTC83230-0025S TC83230-0025 EA09921
Description	From old datasheet system
File Size	1,880.78K / 53 Page	View it Online	Download Datasheet

					Toshiba
Part No.	JTC83230-0021S TC83230-0021 EA09918
Description	From old datasheet system
File Size	1,551.40K / 41 Page	View it Online	Download Datasheet

					Toshiba
Part No.	JTC83230-0011S TC83230-0011 EA09916
Description	From old datasheet system
File Size	1,331.68K / 37 Page	View it Online	Download Datasheet

					Wurth Elektronik GmbH & Co....
Part No.	74438323015
Description	WE-MAPI SMD Power Inductor
File Size	1,060.13K / 6 Page	View it Online	Download Datasheet

					Wurth Elektronik GmbH &...
Part No.	78438323010
Description	WE-MAIA SMD Power Inductor
File Size	406.01K / 7 Page	View it Online	Download Datasheet

For 83230 Found Datasheets File :: 52+ Page :: | 1 | 2 | <3> | 4 | 5 | 6 |

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