| |
|
 |
Amphenol Communications Solutions |
| Part No. |
65780-008
|
| Description |
Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Through Hole, Top Entry, Single Row, 8 Position ,2.54mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
 |

Molex Electronics Ltd.
|
| Part No. |
15-80-0089 0015800089 A-70567-0274
|
| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Plat Molex Electronics Ltd.
|
| File Size |
1,218.52K /
7 Page |
View
it Online |
Download Datasheet
|
| |
|
 |
Amphenol Communications Solutions |
| Part No. |
65780-008LF
|
| Description |
Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Through Hole, Top Entry, Single Row, 8 Position ,2.54mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
 |

Molex Electronics Ltd.
|
| Part No. |
15-80-0087 0015800087 A-70567-0206
|
| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating Molex Electronics Ltd.
|
| File Size |
1,218.48K /
7 Page |
View
it Online |
Download Datasheet
|
| |
|
 |
Amphenol Communications Solutions |
| Part No. |
68000-804-100040LF
|
| Description |
BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical Header, Through Hole, Single Row, 4 Positions
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
 |

Molex Electronics Ltd.
|
| Part No. |
15-80-0085 0015800085 A-70567-0138
|
| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plati Molex Electronics Ltd.
|
| File Size |
1,218.46K /
7 Page |
View
it Online |
Download Datasheet
|
| |
|
 |
Amphenol Communications Solutions |
| Part No. |
10121506-080008BLF
|
| Description |
HPCE STD VT Receptacle 8P8S
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
 |
Amphenol Communications Solutions |
| Part No. |
10121510-080008ALF
|
| Description |
HPCE R/A Receptacle 8P8S
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
 |

Molex Electronics Ltd.
|
| Part No. |
15-80-0081 A-70567-0002 0015800081 705670002
|
| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating Molex Electronics Ltd.
|
| File Size |
1,218.39K /
7 Page |
View
it Online |
Download Datasheet
|
|

Bom2Buy.com

Price and Availability
|