44067-0802 pdf Datasheet P3 Part Num --- IC-ON-LINE

Texas Instruments

Part No.

5962R0720802VXC

Description

12-Bit, 500-MSPS Analog-to-Digital Converter - Class V 84-CFP -55 to 125

Tech specs

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44067-0802 Datasheet PDF File

For 44067-0802 Found Datasheets File :: 150+ Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

				MOLEX INC
Part No.	0440671401
Description	14 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
File Size	29.77K / 2 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	44067-1601 0440671601
Description	3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
File Size	204.11K / 3 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	44067-1602 0440671602
Description	3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
File Size	204.16K / 3 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	44067-1802 0440671802
Description	3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
File Size	203.99K / 3 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	44067-1801 0440671801
Description	3.00mm (.118) Pitch Micro-Fit 3.0?/a> Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 18 Circuits, Tin (Sn) Plating 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 18 Circuits, Tin (Sn) Plating
File Size	203.94K / 3 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	44067-1603 0440671603
Description	3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
File Size	203.98K / 3 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	44067-0403 0440670403
Description	3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 4 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating 3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 4 Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selectiv
File Size	204.16K / 3 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	0440671002 44067-1002
Description	3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") MOLEX Connector
File Size	204.16K / 3 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	0440672402 44067-2402
Description	3.00mm (.118) Pitch Micro-Fit 3.0?/a> Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating MOLEX Connector
File Size	204.16K / 3 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	0440672403 44067-2403
Description	3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating MOLEX Connector
File Size	204.16K / 3 Page	View it Online	Download Datasheet

For 44067-0802 Found Datasheets File :: 150+ Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |