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1N3273 CS7410 85EPS08 AQV221N HIN202E AD8331 AN930 AT7823
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SEOUL[Seoul Semiconductor]
Part No. SSC-ERT801
OCR Text ... the components shall be dried; 24hr at 805C or 12Hr at 1005C. (5) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (6) Quick cooling shall be avoided....
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File Size 266.80K  /  8 Page

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    SEOUL[Seoul Semiconductor]
Part No. SSC-FAT801
OCR Text ... the components shall be dried; 24hr at 805C or 12Hr at 1005C. (5) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (6) Quick cooling shall be avoided....
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File Size 248.40K  /  8 Page

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    SEOUL[Seoul Semiconductor]
Part No. SSC-KWT733
OCR Text ... the components shall be dried; 24hr at 805 or 12Hr at 1005. (5) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (6) Quick cooling shall be avoided. (...
Description TOP LED DEVICE

File Size 443.19K  /  11 Page

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    SEOUL[Seoul Semiconductor]
Part No. SSC-LUYT801
OCR Text ... the components shall be dried; 24hr at 805C or 12Hr at 1005C. (5) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (6) Quick cooling shall be avoided....
Description TOP LED DEVICE

File Size 291.65K  /  8 Page

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    SEOUL[Seoul Semiconductor]
Part No. SSC-MBT801
OCR Text ... the components shall be dried; 24hr at 805C or 12Hr at 1005C. (5) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (6) Quick cooling shall be avoided....
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File Size 255.62K  /  8 Page

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    SEOUL[Seoul Semiconductor]
Part No. SSC-MGT801
OCR Text ... the components shall be dried; 24hr at 805C or 12Hr at 1005C. (5) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (6) Quick cooling shall be avoided....
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File Size 251.00K  /  8 Page

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    SEOUL[Seoul Semiconductor]
Part No. SSC-MSBT801
OCR Text ... the components shall be dried; 24hr at 805C or 12Hr at 1005C. (5) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (6) Quick cooling shall be avoided....
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File Size 349.75K  /  12 Page

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    SEOUL[Seoul Semiconductor]
Part No. SSC-MWT823N
OCR Text ... the components shall be dried; 24hr at 805 or 12Hr at 1005. (5) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (6) Quick cooling shall be avoided. (...
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File Size 349.85K  /  11 Page

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    SEOUL[Seoul Semiconductor]
Part No. SSC-MWT833N
OCR Text ... the components shall be dried; 24hr at 805 or 12Hr at 1005. (5) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (6) Quick cooling shall be avoided. (...
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File Size 350.44K  /  11 Page

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    SEOUL[Seoul Semiconductor]
Part No. SSC-SRT801
OCR Text ... the components shall be dried; 24hr at 805C or 12Hr at 1005C. (5) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (6) Quick cooling shall be avoided....
Description TOP LED DEVICE

File Size 263.98K  /  7 Page

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For 24hr Found Datasheets File :: 134    Search Time::0.797ms    
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