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For wedge Found Datasheets File :: 1098 Search Time::6.266ms
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				Agilent (Hewlett-Packard) HP[Agilent(Hewlett-Packard)]
Part No.	MSA-0400
OCR Text	...c die attach at 400C and either wedge or ball bonding using 0.7 mil gold wire. See APPLICATIONS section, "Chip Use". Chip Outline[1] Description The MSA-0400 is a high performance silicon bipolar Monolithic Microwave Integrated Circu...
Description	Cascadable Silicon Bipolar MMIC Amplifier
File Size	49.94K / 4 Page	View it Online	Download Datasheet

				Agilent (Hewlett-Packard) HP[Agilent(Hewlett-Packard)]
Part No.	MSA-0800 MSA-0800-GP4
OCR Text	...c die attach at 400C and either wedge or ball bonding using 0.7 mil gold wire.[1] See APPLICATIONS section, "Chip Use". Chip Outline[1] Note: 1. Refer to the APPLICATIONS section "Silicon MMIC Chip Use" for additional information. ...
Description	Cascadable Silicon Bipolar MMIC Amplifier
File Size	70.16K / 4 Page	View it Online	Download Datasheet

				Intersil, Corp. HP[Agilent(Hewlett-Packard)] Agilent (Hewlett-Packard)
Part No.	MSA-0900 MSA-0900-GP4
OCR Text	...c die attach at 400C and either wedge or ball bonding using 0.7 mil gold wire. This chip is intended to be used with an external blocking capacitor completing the shunt feedback path (closed loop). Data sheet characterization is given for a...
Description	Cascadable Silicon Bipolar MMIC Amplifier 级联硅双极MMIC放大
File Size	50.54K / 4 Page	View it Online	Download Datasheet

				Agilent(Hewlett-Packard... Agilent (Hewlett-Packard) HP[Agilent(Hewlett-Packard)] Avago Technologies, Ltd.
Part No.	MSA-0300 MSA-0300-GP4
OCR Text	...c die attach at 400C and either wedge or ball bonding using 0.7 mil gold wire.[1] See APPLICATIONS section, "Chip Use". Chip Outline[1] Description The MSA-0300 is a high performance silicon bipolar Monolithic Microwave Integrated Ci...
Description	Cascadable Silicon Bipolar MMIC Amplifier 级联硅双极MMIC放大
File Size	50.24K / 4 Page	View it Online	Download Datasheet

				Plato HP[Agilent(Hewlett-Packard)] Agilent (Hewlett-Packard)
Part No.	MSA-1100 MSA-1100-GP4
OCR Text	...c die attach at 400C and either wedge or ball bonding using 0.7 mil gold wire. Chip Outline[1] 3 5 2 1 4 Description The MSA-1100 is a high performance silicon bipolar Monolithic Microwave Integrated Circuit (MMIC) chip. Th...
Description	Cascadable Silicon Bipolar MMIC Amplifier 级联硅双极MMIC放大
File Size	52.25K / 4 Page	View it Online	Download Datasheet

				HITTITE[Hittite Microwave Corporation]
Part No.	HMC294
OCR Text	...ding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ulrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or substrat...
Description	GaAs MMIC DOUBLE-BALANCED MIXER, 25 - 40 GHz
File Size	171.55K / 6 Page	View it Online	Download Datasheet

				美国讯泰微波有限公司上海代表 HITTITE[Hittite Microwave Corporation]
Part No.	HMC364
OCR Text	...edule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams ...
Description	GaAs HBT MMIC DIVIDE-BY-2, DC - 13.0 GHz
File Size	185.26K / 6 Page	View it Online	Download Datasheet

				NEC, Corp. NEC[NEC]
Part No.	NE321000 NE321000-
OCR Text	...ding should be performed with a wedge tip that has a taper of approximately 15 %. Bonding time should be kept to minimum. As a general rule, the bonding operation should be kept within a 280 C, 2 minutes for all bonding wires. If longer per...
Description	TRANSISTOR \| JFET \| N-CHANNEL \| 4V V(BR)DSS \| 15MA I(DSS) \| CHIP 晶体管\|场效应\| N沟道\| 4V五（巴西）直\| 15mA的我（直）\|芯片 C to Ka BAND SUPER LOW NOISE AMPLIFIER N-CHANNEL HJ-FET CHIP
File Size	46.74K / 12 Page	View it Online	Download Datasheet

				NEC[NEC]
Part No.	NE32400 NE24200
OCR Text	...ding should be performed with a wedge tip that has a taper of approximately 15 %. Bonding time should be kept to minimum. As a general rule, the bonding operation should be kept within a 280 C, 2 minutes for all bonding wires. If longer per...
Description	C to Ka BAND SUPER LOW NOISE AMPLIFIER N-CHANNEL HJ-FET CHIP
File Size	84.47K / 8 Page	View it Online	Download Datasheet

For wedge Found Datasheets File :: 1098 Search Time::6.266ms
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