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wafer-carrier Datasheet PDF File

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				SUTEX[Supertex, Inc]
Part No.	VN2460 VN2460N3 VN2460N8 VN2460NW
OCR Text	...e carrier tape reels. ** Die in wafer form. Features Free from secondary breakdown Low power drive requirement Ease of paralleling Low CISS and fast switching speeds Excellent thermal stability Integral Source-Drain diode High in...
Description	N-Channel Enhancement-Mode Vertical DMOS FETs
File Size	451.05K / 4 Page	View it Online	Download Datasheet

				VAISH[Vaishali Semiconductor]
Part No.	VT83201 VT83201_D VT83201_DW VT83201S1 VT83201S1X VT83201/DW
OCR Text	...el Dice in waffle packe Dice in wafer form No. of Pins 16 16 Package SOIC SOIC Temperature 0C to +70C 0C to +70C 0C to +70C 0C to +70C MDST-0011-01 Page 4 www.Vaishali.com 747 Camden Avenue, Suite C Campbell CA 95008 Ph. 408...
Description	PTSE 16C 16#16 PIN RECP PTSE 16C 16#16 SKT RECP 3.3V Low Phase Noise VCXO Voltage-Controlled Crystal Oscillator and PLL Clock Synthesizer
File Size	44.35K / 4 Page	View it Online	Download Datasheet

				Supertex Inc Supertex Inc SUTEX[Supertex, Inc]
Part No.	TN2435 TN2435N8 TN2435NW
OCR Text	wafer form. RDS(ON) (max) 6.0 ID(ON) (min) 1.0A Order Number / Package TO-243AA* TN2435N8 Die** TN2435NW Product marking for TO-...carrier tape reels. Features High input impedance Low input capacitance Fast switching speeds...
Description	N-Channel Enhancement-Mode Vertical DMOS FETs
File Size	442.60K / 4 Page	View it Online	Download Datasheet

				SUTEX[Supertex, Inc]
Part No.	TP5335 TP5335K1 TP5335NW
OCR Text	...mber/Package TO-236AB* TP5335K1 Wafer TP5335NW Product marking for SOT-23 P3S Where =2-week alpha date code Same as SOT-23. All units shipped on 3,000 piece carrier tape reels. Features Free from secondary breakdown Low power d...
Description	P-Channel Enhancement-Mode Vertical DMOS FETs
File Size	429.61K / 2 Page	View it Online	Download Datasheet

				NXP Semiconductors PHILIPS[Philips Semiconductors]
Part No.	UAA3587
OCR Text	... (and hence lower-cost) silicon wafer processing. Using flip-chip techniques, the active die is direct-bonded to the passive component die, thereby eliminating the need for any mechanical or interconnect substrate.The whole assembly is then...
Description	Complete, single-package GSM/GPRS/EDGE RF transceiver
File Size	48.44K / 2 Page	View it Online	Download Datasheet

				Microchip Technology
Part No.	TC52
OCR Text	...ldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company's quality system processes and procedures are QS-9000 compliant for its PICmic...
Description	Dual Channel Voltage Detector
File Size	445.92K / 11 Page	View it Online	Download Datasheet

				AD[Analog Devices]
Part No.	AD574 AD574A AD574AJ AD574AJE AD574AJN AD574AJP AD574AK AD574AKD AD574AKE AD574AKN AD574AKP AD574AL AD574ALD AD574ALN AD574ASD AD574AU AD574AJD
OCR Text	...g of thin-film resistors at the wafer stage. The voltage reference uses an implanted buried Zener for low noise and low drift. On the digita...Carrier. Specifications subject to change without notice. -2- REV. B AD574A Model RESOLUTI...
Description	Ic-12-bit ADC Complete 12-Bit A/D Converter
File Size	371.87K / 12 Page	View it Online	Download Datasheet

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