|
|
 |
ATMEL[ATMEL Corporation]
|
Part No. |
AT24C64C AT24C32C
|
OCR Text |
...EDEC SOIC, 8-lead TSSOP, 8-lead Ultra Thin Mini-MAP (MLP2x3), and 8-ball dBGA2 Packages. * Die Sales: Wafer Form, Waffle Pack, and Bumped Wafers
* * * * * * * * *
2-Wire Serial EEPROM
32K (4096 x 8) 64K (8192 x 8)
Description
The... |
Description |
2-Wire Serial EEPROM
|
File Size |
388.20K /
21 Page |
View
it Online |
Download Datasheet
|
|
|
 |
ATMEL[ATMEL Corporation]
|
Part No. |
AT24C512B_07 AT24C512B
|
OCR Text |
...TSSOP, 8-ball dBGA2, and 8-lead Ultra Thin Small Array (SAP) Packages Die Sales: Wafer Form, Waffle Pack and Bumped Die
Two-wire Serial EEPROM
512K (65,536 x 8)
AT24C512B
with Three Device Address Inputs
Description
The AT24C512... |
Description |
Two-wire Serial EEPROM
|
File Size |
815.89K /
20 Page |
View
it Online |
Download Datasheet
|
|

Price and Availability
|