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				Dynex Semiconductor
Part No.	MAS3690CS MAS3690NB MAS3691CB MAS3690CB MAQ3690FL MAQ3690NB MAQ3690FD MAQ3690FC MAQ3691CB MAQ3690FB MAQ3690NS MAQ3690CS MAQ3690NL MAH3693NL MAQ3693NL MAR3693NL
OCR Text	...s under which the chip set will perform an automatic retry and the number of retries to be carried out (max. 3). at the end of each instruction execution cycle, the chip set writes a report word into the subsystem memory; the contents of wh...
Description	1553B bus controller/remote terminal
File Size	430.29K / 41 Page	View it Online	Download Datasheet

				Toshiba Semiconductor
Part No.	TLP848
OCR Text	...alues) as an evaluation. Please perform reflow soldering under the above conditions. * * * * The first reflow process should be performed under the above temperature profile within 168 h after opening the bag. If a second reflow process nee...
Description	Personal Equipment and Small-sized OA Equipment
File Size	229.92K / 12 Page	View it Online	Download Datasheet

				Toshiba Semiconductor
Part No.	TPS85007 TPS850 TPS850-07
OCR Text	...emperature: 260C (max) * Please perform reflow soldering using the following reference temperature profile. perform reflow soldering no more than twice. Temperature (C) 260C max 230C 190C 180C Preheating part 60 s to 120 s 30 s to...
Description	Photo-IC Silicon Epitaxial Planar
File Size	269.02K / 10 Page	View it Online	Download Datasheet

				Toshiba Semiconductor
Part No.	TPS85107
OCR Text	...emperature: 260C (max) * Please perform reflow soldering using the following reference temperature profile. perform reflow soldering no more than twice. Temperature (C) 260C max 230C 190C 180C Preheating part 60 s to 120 s 30 s to...
Description	Silicon Epitaxial Planar
File Size	266.22K / 12 Page	View it Online	Download Datasheet

				Toshiba Semiconductor
Part No.	TPS852
OCR Text	...itions: 60C for 12 h or longer, perform baking only once (3) Mounting Precautions (1) (2) (3) Do not apply stress to the resin at high temperature. The resin part is easily scratched, so avoid friction with hard materials. When insta...
Description	Silicon Epitaxial Planar
File Size	240.54K / 12 Page	View it Online	Download Datasheet

				Toshiba Semiconductor
Part No.	TPS85307 TPS853
OCR Text	...alues) as an evaluation. Please perform reflow soldering under the above conditions. perform reflow soldering no more than twice. * Please perform the first reflow soldering within 168 h after opening the package with reference to the above...
Description	Mobile Phones, PHS Notebook PCs, PDAs Video cameras, Digital Still Cameras Other Equipment Requiring Luminosity Adjustment
File Size	270.62K / 12 Page	View it Online	Download Datasheet

				Toshiba Semiconductor
Part No.	TPS853
OCR Text	...emperature: 260C (max) * Please perform reflow soldering using the following reference temperature profile. perform reflow soldering no more than twice. Temperature (C) 260C max 230C 190C 180C Preheating part 60 s to 120 s 30 s to...
Description	TOSHIBA Photo IC Silicon Epitaxial Planar
File Size	172.75K / 12 Page	View it Online	Download Datasheet

				Toshiba Semiconductor
Part No.	TPS856
OCR Text	...itions: 60C for 12 h or longer, perform baking only once (3) Mounting Precautions TPS856 uses a clear resin, and delicate handling is necessary for it. The characteristic change or the product might be damaged by the handling method ...
Description	Mobile Phones Notebook PCs, PDAs Video cameras, Digital Still Cameras Other Equipment Requiring Luminosity Adjustment
File Size	284.50K / 13 Page	View it Online	Download Datasheet

				Murata Manufacturing Co...
Part No.	GNM314R61A105MA13D
OCR Text	... high dielectric constant type perform a heat treatment at 150 +0/-10c for one hour and then set for 242 hours at room temperature. perform the initial measure-ment. 10 adhesive strength no removal of the terminations or other defect ...
Description	CHIP MONOLITHIC CERAMIC CAPACITOR GNM314R61A105MA13_ (1206, X5R, 1uF, 10Vdc)
File Size	468.50K / 24 Page	View it Online	Download Datasheet

				Toshiba Semiconductor
Part No.	TLCBK1100BT11
OCR Text	...ed devices within 72 hours, but perform baking only once. baking conditions: 60 5c, for 24 to 48 hours. expiration date: 12 months from sealing date, which is imprinted on the label affixed. 4. repeated baking can cause the pee ling st...
Description	Panel Circuit Indicator
File Size	291.86K / 9 Page	View it Online	Download Datasheet

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