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  memory-die Datasheet PDF File

For memory-die Found Datasheets File :: 6160    Search Time::1.985ms    
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    Motorola
Part No. MPC603E7TEC
OCR Text ...nd on-chip instruction and data memory management units (mmus). the mmus contain 64-entry, two-way set-associative, data and instruction tra...die size 5.65 mm x 7.7 mm (44 mm 2 ) transistor count 2.6 million logic design fully-static pack...
Description MPC603r RISC Microprocessor Family PID7t-603e Hardware Specification Advance Information Technical Data

File Size 210.51K  /  28 Page

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    M378T3253FGZ0-CE6/D5/CC M378T6453FGZ0-CE6/D5/CC M391T3253FGZ0-CE6/D5/CC M391T6453FGZ0-CE6/D5/CC M378T6453FG3-CCC M391T64

SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. M378T3253FGZ0-CE6/D5/CC M378T6453FGZ0-CE6/D5/CC M391T3253FGZ0-CE6/D5/CC M391T6453FGZ0-CE6/D5/CC M378T6453FG3-CCC M391T6453FG3-CCC M378T3253FG3-CCC M391T3253FG3-CCC M378T3253FG3-CE6 M378T6453FG3-CE6 M391T3253FG3-CE6 M391T6453FG3-CE6 M391T3253FG0-CE6 M391T3253FZ0-CE6 M391T3253FZ3-CE6 M378T6453FZ3-CD5 M378T6453FZ0-CD5 M391T6453FG0-CD5 M391T6453FZ0-CD5 M391T6453FZ3-CD5 M378T6453FG0-CD5 M378T3253FZ0-CD5 M391T3253FZ0-CD5 M378T3253FZ3-CD5 M378T6453FZ0-CE6 M378T3253FZ0-CCC M378T3253FZ0-CE6 M391T3253FZ0-CCC M391T6453FZ0-CCC M378T6453FZ0-CCC M378T3253FZ3-CCC M391T6453FZ3-CE6 M391T3253FZ3-CCC M378T3253FZ3-CE6 M378T6453FZ3-CCC M391T6453FZ3-CCC M378T3253FG0-CD5 M378T3253FG0-CCC M378T6453FG0-CCC
OCR Text ...nd is not connected on standard memory module products (dimms.) pin front pin back pin front pin back pin front pin back pin front pin back ...die termination control lines v ref ddr2 sdram i/o reference supply dq0 - dq63 dimm memory data bus ...
Description 64M X 64 DDR DRAM MODULE, 0.6 ns, DMA240
RES 120K OHM 1/6W 5% CARBON FILM
40 Characters x 4 Lines, 5x7 Dot Matrix Character and Cursor
DDR2 Unbuffered SDRAM MODULE 无缓冲DDR2的内存模
Fuses, 20A 250V CERAMIC LEAD 无缓冲DDR2的内存模
40 characters x 2 Lines, 5x7 Dot Matric Character and Cursor 无缓冲DDR2的内存模
DDR2 Unbuffered SDRAM MODULE 无缓DDR2的内存模
RES 11K OHM 1/6W 5% CARBON FILM 无缓冲DDR2的内存模
RES 12K OHM 1/6W 5% CARBON FILM 无缓冲DDR2的内存模

File Size 382.80K  /  20 Page

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    Cypress
Part No. CY7C1304DV25-100BZXC
OCR Text ...wo separate ports to access the memory array. The Read port has dedicated Data Outputs to support Read operations and the Write port has ded...die and so can be connected to any voltage level. Address expansion for 36M. This is not connected t...
Description 9-Mbit Burst of 4 Pipelined SRAM with QDR(TM) Architecture

File Size 224.85K  /  18 Page

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    Conexant Systems
Part No. CX24153 CX24156
OCR Text ...erformance 16 or 32-bit unified memory controller architecture Part Number CX24153/4/6 Description w w w .D a aS t e...die revision (e.g. n=1 for die rev A, 2 for die rev B etc.) CX24153/4/6 Features * MPEG-2 MP@ML ...
Description (CX24153/4/6) Digital Broadcast TV Decoder ic Family

File Size 307.34K  /  4 Page

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    APR9301-V2-1

Aplus Integrated Circuits Inc.
Aplus Intergrated Circuits
Part No. APR9301-V2-1
OCR Text ...omponents * Non-volatile Flash memory technology - No battery backup required - 100K record cycles (typical) - 100-year message retentio...Die Bonding Pad Diagram /C APR9301-V2 Notes: N V CC D CC Bonding Pad Diagram & Descriptio...
Description Circular Connector; No. of Contacts:43; Series:MS27656; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:25; Circular Contact Gender:Socket; Circular Shell Style:Wall Mount Receptacle RoHS Compliant: No
SINGLE-CHIP VOICE RECORDING & PLAYBACK DEVICE FOR SINGLE 20 TO 30 SECOND MESSAGE

File Size 501.44K  /  7 Page

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    SOCKET462

AMD
Part No. SOCKET462
OCR Text ...ith an inadequate power supply, memory, or other supporting components. for the latest information on the components that have been tested b...die damage may result. also notice the lugs on the socket. in later steps, the center lugs will be u...
Description AMD Processor Installation Guide

File Size 1,133.86K  /  20 Page

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Part No. MR18R1624DF0-CM9 MR16R1628DF0-CN9 MR16R1624DF0-CM8 MR16R1624DF0-CM9 MR18R1628DF0-CM8
OCR Text ...ral purpose high- perfor- mance memory module suitable for use in a broad range of applications including computer memory, personal comput...die, 32s banks,16k/32ms ref, 2.5v (16mx18)*2(4/8/16)pcs rimm tm module based on 288mb d-die, 32s b...
Description 64M X 18 RAMBUS MODULE, DMA184
128M X 16 RAMBUS MODULE, DMA184
64M X 16 RAMBUS MODULE, DMA184
128M X 18 RAMBUS MODULE, DMA184

File Size 232.10K  /  16 Page

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    NXP Semiconductors N.V.
Part No. SL1ICS3101W/N5D SL1ICS3101W/N4D00
OCR Text ... FUNCTIONAL DESCRIPTION General Memory organization Serial number Write access conditions Special functions Family code and application iden...Die specifications Wafer specifications APPLICATION INFORMATION Protection against visible light Pro...
Description
File Size 156.42K  /  20 Page

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