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Rochester Electronics LLC |
Part No. |
TN28F010-120-G
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Description |
28F010 - 1-Mbit (128k x 8) NOR Flash Memory
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Tech specs |
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Official Product Page
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Rochester Electronics LLC |
Part No. |
27C010-120DI
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Description |
27C010 - 1024K (128K x 8) CMOS EPROM
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10120818-001CLF
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Description |
SAS 3.0 Connectors, Storage & Server System, Receptacle, Vertical, Surface Mount, 29 Positions, 12Gb/s.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
76350-120-22LF
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Description |
BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Double row , 22 Positions, 2.54mm (0.100in) Pitch
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
93690-101-20LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Press Fit, Double Row, 20 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Molex, Inc. MOLEX INC
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Part No. |
90327-3324 90327-3306 90327-3326 90327-0322 90327-0326
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Description |
1.27mm PF Conn LoPro IDT Wht .76Au 24Ckt 24 CONTACT(S), FEMALE, TWO PART BOARD CONNECTOR, IDC 1.27mm PF Conn LoPro IDT Wht .76Au 6Ckt 6 CONTACT(S), FEMALE, TWO PART BOARD CONNECTOR, IDC CONN RECPT IDT 26POS 1.27MM GOLD 26 CONTACT(S), FEMALE, TWO PART BOARD CONNECTOR, IDC 1.27 mmPF Conn LoPro IDT Wht 2Sn 22Ckt CONNECTOR, PICOFLEX 26WAY ; Ways, No. of:26; Pitch:1.27mm; Colour:White; Current, contact rating:1.2A; Flammability rating:UL94V-0; Material:Polyester; Material, contact:Phosphor bronze alloy; Plating, contact:Tin; Poles, No. of:26;
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File Size |
143.87K /
2 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
75970-120-30LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row,30 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
0903270320 90327-0320
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Description |
1.27mm (.050) Pitch Picoflex? PF-50, Low Profile, IDT Receptacle, 20 Circuits, Natural, Tin Plated 1.27mm (.050) Pitch Picoflex庐 PF-50, Low Profile, IDT Receptacle, 20 Circuits, Natural, Tin Plated
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File Size |
112.15K /
3 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
68001-205HLF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 5 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
0903270322 90327-0322
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Description |
1.27mm (.050) Pitch Picoflex? PF-50, Low Profile, IDT Receptacle, 22 Circuits, Natural, Tin Plated 1.27mm (.050) Pitch Picoflex庐 PF-50, Low Profile, IDT Receptacle, 22 Circuits, Natural, Tin Plated
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File Size |
111.98K /
3 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
51760-10401204AALF
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Description |
PwrBlade®, Power Connectors, 4P 12S 4P Right Angle Receptacle, Solder To Board
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
0903270324 90327-0324
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Description |
1.27mm (.050) Pitch Picoflex? PF-50, Low Profile, IDT Receptacle, 24 Circuits, Natural, Tin Plated 1.27mm (.050) Pitch Picoflex庐 PF-50, Low Profile, IDT Receptacle, 24 Circuits, Natural, Tin Plated
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File Size |
111.98K /
3 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
51701-10001202AALF
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Description |
PwrBlade®, Power Supply Connectors, Vertical Header, With Guide Pin 12S 2P
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
0903270326 90327-0326
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Description |
1.27mm (.050) Pitch Picoflex? PF-50, Low Profile, IDT Receptacle, 26 Circuits, Natural, Tin Plated 1.27mm (.050) Pitch Picoflex庐 PF-50, Low Profile, IDT Receptacle, 26 Circuits, Natural, Tin Plated
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File Size |
112.15K /
3 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
51762-10201200BALF
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Description |
PwrBlade®, Power Connectors, 2P 12S Right Angle Receptacle, Solder To Board
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Tech specs |
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Official Product Page
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Price and Availability
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