Part Number Hot Search : 
TL406 SMF16A GI820 HDM8515 UM4003 00021 FJ596 V1N3035C
Product Description
Full Text Search
  90136-1118 Datasheet PDF File

For 90136-1118 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    90136-2103

Molex Electronics Ltd.
Part No. 90136-2103
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 3 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 254.53K  /  5 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 78290-136HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    90136-2104

Molex Electronics Ltd.
Part No. 90136-2104
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 4 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 254.53K  /  5 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 69190-136HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90136-2225

Molex Electronics Ltd.
Part No. 90136-2225
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 25 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 254.33K  /  5 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 68690-136HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    90136-1206

Molex Electronics Ltd.
Part No. 90136-1206
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 159.24K  /  4 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. U77A11181001
Description SFP CAGE 1X1 TIN TRAY
Tech specs    

Official Product Page

    90136-1202

Molex Electronics Ltd.
Part No. 90136-1202
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 2 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 159.24K  /  4 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. U77C11181011
Description BRIGHT TIN PLT/R EMI PIN
Tech specs    

Official Product Page

    90136-1205

Molex Electronics Ltd.
Part No. 90136-1205
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 5 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 159.24K  /  4 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 68491-118HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 18 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90136-2105

Molex Electronics Ltd.
Part No. 90136-2105
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 5 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 254.53K  /  5 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 77311-118-09LF
Description BergStik®, Board to Board connector, 2.54mm (0.100in), Unshrouded Vertical Header, Through Hole, Single Row, 9 Positions
Tech specs    

Official Product Page

    90136-2106

Molex Electronics Ltd.
Part No. 90136-2106
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 6 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 254.53K  /  5 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 77311-118-19LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    90136-2232

Molex Electronics Ltd.
Part No. 90136-2232
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 32 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 254.33K  /  5 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 77311-118-29LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 29 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    90136-2212

Molex Electronics Ltd.
Part No. 90136-2212
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 254.43K  /  5 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 54111-118021450LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 2 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 90136-1118 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

▲Up To Search▲

 



Bom2Buy.com




Price and Availability



 
Price & Availability of 90136-1118

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X
1.1752531528473