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  44769-1803 Datasheet PDF File

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    44769-1602

Molex Electronics Ltd.
Part No. 44769-1602
Description 3.00mm (.118) Pitch Micro-Fit 3.0, BMI Receptacle Header, Dual Row, Vertical, with Press-fit Plastic Pegs

File Size 141.58K  /  3 Page

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Amphenol Communications Solutions

Part No. 54121-803030800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 3 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    44769-1003

Molex Electronics Ltd.
Part No. 44769-1003
Description 3.00mm (.118) Pitch Micro-Fit 3.0, BMI Receptacle Header, Dual Row, Vertical, with Press-fit Plastic Pegs

File Size 141.56K  /  3 Page

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Amphenol Communications Solutions

Part No. 54111-803080850LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    44769-0602

Molex Electronics Ltd.
Part No. 44769-0602
Description 3.00mm (.118) Pitch Micro-Fit 3.0, BMI Receptacle Header, Dual Row, Vertical, with Press-fit Plastic Pegs

File Size 141.57K  /  3 Page

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Amphenol Communications Solutions

Part No. 89891-803HLF
Description REC VER THT 6pos
Tech specs    

Official Product Page

    44769-0603

Molex Electronics Ltd.
Part No. 44769-0603
Description 3.00mm (.118) Pitch Micro-Fit 3.0, BMI Receptacle Header, Dual Row, Vertical, with Press-fit Plastic Pegs

File Size 141.56K  /  3 Page

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Amphenol Communications Solutions

Part No. 77311-118-03
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 03 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    44769-0801

Molex Electronics Ltd.
Part No. 44769-0801
Description 3.00mm (.118) Pitch Micro-Fit 3.0, BMI?/a> Receptacle Header, Dual Row, Vertical, with Press-fit Plastic Pegs, 2.54μm (100μ) Tin (Sn), 8 Circuits

File Size 141.63K  /  3 Page

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Amphenol Communications Solutions

Part No. 68118-034
Description Quickie® IDC Cable-to-Board Connector System, Wire To Board connector, Quickie IDC Cover.
Tech specs    

Official Product Page

    44769-0803

Molex Electronics Ltd.
Part No. 44769-0803
Description 3.00mm (.118) Pitch Micro-Fit 3.0, BMI Receptacle Header, Dual Row, Vertical, with Press-fit Plastic

File Size 141.64K  /  3 Page

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Amphenol Communications Solutions

Part No. 54111-803020800LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 2 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    44769-2401

Molex Electronics Ltd.
Part No. 44769-2401
Description 3.00mm (.118) Pitch Micro-Fit 3.0, BMI?/a> Receptacle Header, Dual Row, Vertical, with Press-fit Plastic Pegs, 2.54μm (100μ) Tin (Sn), 24 Circuits

File Size 141.64K  /  3 Page

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Amphenol Communications Solutions

Part No. 54121-803090800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 9 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    44769-1001

Molex Electronics Ltd.
Part No. 44769-1001
Description 3.00mm (.118) Pitch Micro-Fit 3.0, BMI?/a> Receptacle Header, Dual Row, Vertical, with Press-fit Plastic Pegs, 2.54μm (100μ) Tin (Sn), 10 Circuits

File Size 141.55K  /  3 Page

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Amphenol Communications Solutions

Part No. 89891-803H
Description Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Dual Entry , 6 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    44769-2402

Molex Electronics Ltd.
Part No. 44769-2402
Description 3.00mm (.118) Pitch Micro-Fit 3.0, BMI?/a> Receptacle Header, Dual Row, Vertical, with Press-fit Plastic Pegs, 0.38μm (15μ) Gold (Au) Selective, 24 Circuits

File Size 141.66K  /  3 Page

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Amphenol Communications Solutions

Part No. 77311-218-03LF
Description BERGSTIK
Tech specs    

Official Product Page

    44769-2403

Molex Electronics Ltd.
Part No. 44769-2403
Description 3.00mm (.118) Pitch Micro-Fit 3.0, BMI Receptacle Header, Dual Row, Vertical, with Press-fit Plastic

File Size 141.65K  /  3 Page

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Amphenol Communications Solutions

Part No. 54111-803040850LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 4 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 44769-1803 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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