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  44475-1011 Datasheet PDF File

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    0444750411 44475-0411

Molex Electronics Ltd.
Part No. 0444750411 44475-0411
Description 4.20mm (.165) Pitch Mini-Fit, HCS Receptacle Header, Dual Row, Vertical, Blind Mating, with Snap-in Plastic Pegs, 4 Circuits
4.20mm (.165) Pitch Mini-Fit, HCS?/a> Receptacle Header, Dual Row, Vertical, Blind Mating, with Snap-in Plastic Pegs, 4 Circuits

File Size 271.84K  /  5 Page

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Amphenol Communications Solutions

Part No. 10118085-101-12LF
Description Unshrouded Right Angle header,Surface Mount, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0444751021

Molex Electronics Ltd.
Part No. 0444751021
Description 4.20mm (.165) Pitch Mini-Fit, HCS Receptacle Header, Dual Row, Vertical, Blind Mating, with Snap-in Plastic Pegs

File Size 271.85K  /  5 Page

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Amphenol Communications Solutions

Part No. 10119333-101-15LF
Description BergStik®, Board to Board connector, Unshrouded horizontal header, Surface mount, Single Row, 15 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0444751811 44475-1811

Molex Electronics Ltd.
Part No. 0444751811 44475-1811
Description 4.20mm (.165) Pitch Mini-Fit, HCS Receptacle Header, Dual Row, Vertical, Blind Mating, with Snap-in Plastic Pegs, 18 Circuits

File Size 271.41K  /  5 Page

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Amphenol Communications Solutions

Part No. 10114829-10110LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 10 Positions
Tech specs    

Official Product Page

    MULTI CONTACT AG
Part No. 23.1011-23
Description INTERCONNECTION DEVICE

File Size 163.40K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114831-10113LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 13 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    EM-1011

Asahi Kasei Microsystems
Part No. EM-1011
Description EM-1011 is ultra-small Hall effect ICs of a single silicon chip composed of Hall element and a signal processing IC

File Size 129.12K  /  3 Page

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Amphenol Communications Solutions

Part No. 10114831-10114LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    03-09-1011

Molex Electronics Ltd.
Part No. 03-09-1011
Description 2.36mm Diameter Standard

File Size 30.58K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114829-10114LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
Tech specs    

Official Product Page

    03-06-1011

Molex Electronics Ltd.
Part No. 03-06-1011
Description 1.57mm Diameter Standard .062 Pin and Socket Receptacle Housing, 1 Circuits

File Size 30.14K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114828-10115LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 15 Positions
Tech specs    

Official Product Page

    03-06-1011-P

Molex Electronics Ltd.
Part No. 03-06-1011-P
Description PLUG & RECEPTACLE HOUSINGS I CIRCUIT

File Size 113.41K  /  3 Page

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Amphenol Communications Solutions

Part No. 10114830-10111LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 11 Positions
Tech specs    

Official Product Page

    silex technology, Inc.
Part No. SX-350-1011
Description
File Size 146.46K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114829-10115LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 15 Positions
Tech specs    

Official Product Page

    50S-1011

JFW Industries, Inc.
Part No. 50S-1011
Description 1P8T SELF TERMINATING SOLID STATE RF SWITCH

File Size 20.79K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114831-10115LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 15 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

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