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  3176 Datasheet PDF File

For 3176 Found Datasheets File :: 50+       Page :: | 1 | <2> | 3 | 4 | 5 |   

    W83176R-732

Winbond Electronics Corp
http://
Part No. W83176R-732
Description WINBOND 2DIMM DDR ZERO DELAY BUFFER FOR SIS CHIPSET
From old datasheet system

File Size 247.97K  /  11 Page

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Amphenol Communications Solutions

Part No. 10131764-11JLF
Description ExaMAX® 56Gb/s High Speed Backplane Connector 92Ohm, 6-Pair, 10 column, 200 position, Right Angle Receptacle, Right Guide Pin.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    W83176G-733

Winbond
Part No. W83176G-733
Description (W83176x-733) Winbond Dual Bank DDR BUFFER

File Size 311.17K  /  14 Page

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Amphenol Communications Solutions

Part No. 10131766-101LF
Description ExaMAX® 56Gb/s High Speed Backplane Connector 92Ohm, 6-Pair, 12 column, 240 position, Right Angle Receptacle, No Guide Pin.
Tech specs    

Official Product Page

    W83176G-735

Winbond
Part No. W83176G-735
Description (W83176x-735) DIMM DDR ZERO DELAY BUFFER

File Size 269.36K  /  13 Page

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Amphenol Communications Solutions

Part No. 131-7614-21D
Description Paladin® 112Gb/s Backplane Connector, 7-Pair, 4 Column, Right Polarized, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    317697-001 82575

Intel Corporation
Part No. 317697-001 82575
Description Gigabit Ethernet Controller

File Size 512.86K  /  69 Page

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Amphenol Communications Solutions

Part No. 131-7618-21H
Description Paladin® 112Gb/s Backplane Connector, 7-Pair, 8 Column, Right Polarized, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

    317610-001 82X38

Intel Corporation
Part No. 317610-001 82X38
Description Express Chipset

File Size 2,144.01K  /  342 Page

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Amphenol Communications Solutions

Part No. 10131764-12JLF
Description ExaMAX® 56Gb/s High Speed Backplane Connector 92Ohm, 6-Pair, 10 column, 200 position, Right Angle Receptacle, Left Guide Pin.
Tech specs    

Official Product Page

    82G35 317607-001

Intel Corporation
Part No. 82G35 317607-001
Description Express Chipset

File Size 2,615.54K  /  351 Page

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Amphenol Communications Solutions

Part No. 10131768-11JLF
Description ExaMAX® 56Gb/s High Speed Backplane Connector 92Ohm, 6-Pair, 14 column, 280 position, Right Angle Receptacle, Right Guide Pin.
Tech specs    

Official Product Page

    SONY
Part No. CXA3176N
Description IF Amplifier for FM Receiver(AFC Supported)

File Size 313.52K  /  21 Page

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Amphenol Communications Solutions

Part No. 131-7616-11D
Description Paladin® 112Gb/s Backplane Connector, 7-Pair, 6 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    W83176G-400 W83176R-400

Winbond
http://
Part No. W83176G-400 W83176R-400
Description Winbond Current Mode Differential Buffer for PCI Express and SATA

File Size 256.75K  /  12 Page

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Amphenol Communications Solutions

Part No. 10131762-11JLF
Description ExaMAX® 56Gb/s High Speed Backplane Connector 92Ohm, 6-Pair, 8 column, 160 position, Right Angle Receptacle, Right Guide Pin.
Tech specs    

Official Product Page

   
Part No. UC3176QP
Description 1.3 Megapixel single-chip camera module

File Size 403.64K  /  5 Page

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Amphenol Communications Solutions

Part No. 131-7614-11D
Description Paladin® 112Gb/s Backplane Connector, 7-Pair, 4 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    W83176R-401 W83176G-401

http://
Winbond
Part No. W83176R-401 W83176G-401
Description Winbond Current Mode Differential Buffer for PCI Express and SATA

File Size 260.32K  /  14 Page

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Amphenol Communications Solutions

Part No. 131-7618-11H
Description Paladin® 112Gb/s Backplane Connector, 7-Pair, 8 Column, Right Polarized, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

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